...Maciej Sobolewski; Barbara Dziurdzia Purpose The purpose of the paper is to experimentally evaluate the impact of voids on thermal conductivity of a macro solder joint formed between a copper cylinder and a copper plate by using reflow soldering. Design/methodology/approach A model...

... © Emerald Group Publishing Limited 2006 --> Heat transfer Thermal conductivity Laird technologies now offer a range of high-performance thermally conductive gap fillers to counter electronics heat transfer problems Keywords: Heat transfer, Thermal conductivity...

... the accelerated test. Throughout the temperature drop, no transient heat transfer was considered and the temperature within the whole sample was assumed to be uniform at every time increment. © Emerald Group Publishing Limited 2004 Isotopes Surface fitting Thermal conductivity Fatigue...

...R.L. Dietz; D. Peck; P.J. Robinson; M.G. Firmstone; P.M. Bartholomew; G. Paterson The trend towards higher density, higher frequency, higher power active devices in placing increasingly difficult demands on device packaging. Materials with high thermal conductivities are replacing the traditional...