...Maciej Sobolewski; Barbara Dziurdzia Purpose The purpose of the paper is to experimentally evaluate the impact of voids on thermal conductivity of a macro solder joint formed between a copper cylinder and a copper plate by using reflow soldering. Design/methodology/approach A model...

... Such thermally conductive gap fillers can provide the perfect solution to difficult thermal management problems that electronic product designers often encounter today. Typically, the products will enhance the thermal performance of an electrical system by effectively filling gaps between...

... configurations on thermal stresses was also evaluated with numerical calculations. © Emerald Group Publishing Limited 2004 Isotopes Surface fitting Thermal conductivity Fatigue Finite element analysis Stress (materials) Figure 1(a) shows the cross‐section of a typical ICA joint before...

...R.L. Dietz; D. Peck; P.J. Robinson; M.G. Firmstone; P.M. Bartholomew; G. Paterson The trend towards higher density, higher frequency, higher power active devices in placing increasingly difficult demands on device packaging. Materials with high thermal conductivities are replacing the traditional...