... of this study is to investigate the degradation of electrical performance and failure mechanisms of GaN HEMT devices under the combined effects of electron irradiation and thermal cycling, providing valuable reference information for the reliability assessment of GaN HEMT devices. Design/methodology...

.... During service life, electronic devices are susceptible to various mechanical and thermomechanical loading conditions leading to device failures. In fact, 55% of the electronic devices’ failures are due to the temperature and thermal cycling loadings (Steinberg, 1988). Thus, several research...

... Reliability Thermal cycling Lifetime Heat dissipation performance Double-sided packaging structure Single-sided packaging structure It can be seen from Figure 6 that the temperature of the single-sided package structure on the SiC MOSFET was the highest, and the maximum junction temperature...

... standards at RT and at CT. Charpy impact test results were used to find out ductile to brittle transition temperature (DBTT). These properties were also evaluated after thermal cycling (TC) to find out effect of thermal stress. Scanning electron microscope analysis was performed to understand fracture...

...-use rights only Thermal fatigue Machine learning Solder joints failure prediction Thermal cycling Cracks Drop Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic devices and printed circuit boards (PCB...

...Fang Liu; Jiacheng Zhou; Nu Yan Purpose The purpose of this paper is to study the drop reliability of ball-grid array (BGA) solder joints affected by thermal cycling. Design/methodology/approach The drop test was made with the two kinds of chip samples with the thermal cycling...

... thermal cycling. Design/methodology/approach – Solder joints of diodes and resistors samples made on long FR-4 and aluminum (Al) core printed circuit boards were examined. Two kinds of solder pastes were used for the samples preparation. All samples were subjected to temperature aging cycles (−40°C...

... tolerances. Surface‐mount technology Solders Assembly Reliability 01005 Stencil Thermal cycling The increasing functionality of ever‐smaller electronics, and wireless products in particular, is driving the evolution of thinner printed‐circuit boards (PCBs) and parts, the use of smaller...