.... Design/methodology/approach In this study, the influence of five different chip power sizes on the Sn0.3Ag0.5Cu (SAC305) solder joints in Package-on-Package (POP) structures under thermal-drop impact load is systematically investigated. The board-level POP package structure is modeled using finite...

... In this paper, a three-dimensional finite element model of board-level ball grid array (BGA) package structure is established, and numerical calculations are performed based on thermal-drop impact load sequence coupling. The effects of chip thickness, solder ball height, diameter and array on its temperature...