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Keywords: Titanium dioxide nanoparticle
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Journal Articles
Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (1): 1–13.
Published: 09 January 2018
... to reinforce the solder joints during the electronic assembly process (Noor and Singh, 2014). Several lead-free solder materials, such as Sn-3.5Ag-0.7Cu (SAC), SnAg, SnCu and SnZn, are commonly blended with various types of nanoparticles. SAC305 Nano-reinforced lead free solder Titanium dioxide...
