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Keywords: Ultra-fine package
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Journal Articles
Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Mohamad Aizat Abas, Zuraihana Bachok, Norinsan Kamil Othman
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 109–124.
Published: 18 December 2018
... a profound understanding of nano-reinforced solder joint’s characteristics of the ultra-fine package. Fakhrozi Che Ani can be contacted at: fakhroziukm@gmail.com 13 08 2018 20 09 2018 30 10 2018 © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use...
Journal Articles
Fakhrozi Che Ani, Azman Jalar, Abdullah Aziz Saad, Chu Yee Khor, Roslina Ismail, Zuraihana Bachok, Mohamad Aizat Abas, Norinsan Kamil Othman
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (1): 1–13.
Published: 09 January 2018
... helios NanoLab 650 dual beam system) The height of the soldered fillet in the ultra-fine solder joint was inspected to determine its effect on the reliability of the joint in the ultra-fine package. It was quantified using scanning electron microscopy. The minimum fillet height should be above...
