...Guisheng Gan; Shi-qi Chen; Liujie Jiang; Cong Liu; Peng Ma; Tian Huang; Dayong Cheng; Xin Liu Purpose This study aims to research properties of Cu/SAC0307 mixed solder balls/Al joints with different bonding temperature under ultrasonic-assisted. Design/methodology/approach A new method that 1...

... (SAC0307) with a particle size of 25–38 µm were mixed to fill the joint and successfully achieved the micro-joining of Cu/Cu under ultrasonic-assisted at low-temperature, and then the effect of thermal aging temperature on the properties of Cu/Cu joints was researched. Findings The composition...