...Min Wu; Bailin Lv Purpose Viscosity is an important basic physical property of liquid solders. However, because of the very complex nonlinear relationship between the viscosity of the liquid ternary Sn-based lead-free solder and its determinants, a theoretical model for the viscosity of the liquid...

.... These experiments consist of the analysis of the viscosity, yield stress, thixotropy, elastic and viscous properties through oscillatory tests and the capacity to recover using a creep-recovery experiment. The results obtained from this rheological analysis are compared with the rheological properties of the solder...

... as the viscosity definitions in numerical simulations instead of simpler models like Carreau–Yasuda and cross-viscosity models. Originality/value The rheological description of the solder paste is critical in determining its validity for a given application. The methodology described in the paper provides...

...Oliver Krammer; Benjámin Gyarmati; András Szilágyi; Richárd Storcz; László Jakab; Balázs Illés; Attila Géczy; Karel Dušek Purpose A measurement method has been developed to reveal the viscosity change of solder pastes during stencil printing. This paper aimed to investigate thixotropic behaviour...

...Przemyslaw Fima; Tomasz Gancarz; Janusz Pstrus; Krystyna Bukat; Janusz Sitek Purpose The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior...

... of rheological characterization techniques including viscosity, yield stress, oscillatory and creep‐recovery tests were carried out to investigate the rheological properties and behaviours of four different solder paste formulations based on no‐clean flux composition, with different alloy composition, metal...

... the creep‐recovery, thixotropy and viscosity test methods. A rheometer with a parallel plate measuring geometry of 40 mm diameter and a gap height of 1 mm was used to characterise the paste and associated flux media. Findings The results from the study showed that the creep‐recovery test can be used...

... applications. After selection of the appropriate solder pastes, reliability tests were conducted. The surface insulation resistance was tested for both the hybrid circuits and PCBs, whereas the mechanical strength of the soldered joints of components was only tested for the PCBs. Solders Viscosity...

... on the printing process and in particular the effect on paste transfer efficiency. © MCB UP Limited 2001 Solder paste Stencil printer Viscosity Pastes Over the years, the electronic industry has seen tremendous growth, and the main driver for this growth has been the exponential growth...