Issues

Appointments

New EIPC executive director appointed

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Ron Desilets joins HDlnterconnect Technology as VP of sales and marketing

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Gregg Turcich appointed product manager, laminate products

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Lloyd Doyle announces new appointment

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Joseph Ng promoted to marketing director, Asia-Pacific region

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Bill Miranda appointed vice president, sales

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Dave Howard appointed global accounts manager

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Frando van der Pas appointed product manager, Enthone® Imaging Technologies

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Association news

CAF susceptibility of PCA substrates – an NPL project

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Report on the Institute of Circuit Technology 27th Annual Symposium – 2001 Printed Circuit Odyssey

Pete Starkey
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IPC honors best paper award at Printed Circuits Expo 2001

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IPC issues call for papers for Printed Circuits Expo 2002

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IPC honors members at Printed Circuits Expo for outstanding contributions

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Book review

Dry Film Photoresist Processing Technology

Brian Ellis
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The use of statistical experimental design for PCB process optimisation

David Albin
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Asia: the growth engine for the world electronics industry over the next 20 years

Shiuh‐Kao Chiang
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Integrated passives in advanced printed wiring boards

Stephen O’Reilly; Maeve Duffy; Terence O’Donnell; Paul McCloskey; Seán Cian Ó Mathúna
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Finite element modeling to analyze durability of BGA/CSP connections during thermal shock

Subhotosh Khan; Dan J. Molligan
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Low cost HDI multilayers – the power mesh architecture

Happy Holden
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Comment

The impact of the climate change levy on the UK PCB industry

Martin Goosey
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Editorial

Editorial

Martin Goosey
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Frank Coultard column

PCIF

Frank Coultard
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Industry news

Enthone receives Intel's preferred quality supplier award

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Union Tool's new European technical service centre

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Ruwel branches in the USA and Hong Kong

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More orders for Lloyd Doyle

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Jabil opens in Budapest

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N6000 gains acceptance for digital broadband and hi-rel applications

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Ruwel diverts investment to Germany

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HDlnterconnect Technology occupies new facility

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Hebrew University researchers develop printed circuits on paper

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Orbotech acquires certain technology and know-how from Brown & Sharpe

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Labtech opens MMIC assembly facility

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Dyconex moves into new plant

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Patent application US6020049: product for producing viaholes in reinforced laminates and the related method for manufacturing viaholes

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Tyco acquisition

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Tough times ahead for PCB industry

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International diary

International diary

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Internet commentary

Internet commentary

Brian Ellis
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New products

TECNU® Inc. introduces new instrumentation to improve the electroplating of PCBs

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Siemens and Dynamic Details to develop green laser solutions for PCB manufacturing

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Innoveda's PowerPCB now offers board fabrication checking

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Barco launches AUTOPLOT Server

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OLEC introduces the Digital Core Punch

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ESI introduces new dual head laser microvia drilling platform enabling improved performance and accuracy

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Frontline launches the ODB++ Communicator

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GE Electromaterials introduces printed circuit board design site

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Cimnet Systems, Inc. announces new version of Paradigm® software and new vision

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Valor announces new enterprise release for DFM and physical design verification

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Orbotech, Printed circuit boards

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Barco launches AUTOTEST for most efficient combinational tests

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Orbotech introduces large format AOI system

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GraphiCode releases new version of GC-PowerStation

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Publications

Enthone® Final Finishes Selection Guide published by Polyclad Technologies

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Imaging 2000™

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