...C.R. Raghunath; U. Raghunath; H.S. Yeshaswini; H. Rashmi Purpose The purpose of this paper is to detail various aspects of laminates and their current developments in order to enable the selection and development of appropriate laminate systems for use in high performance avionics interconnection...

... parameters such as ultrasonic intensity/power and process temperature were investigated. Design/methodology/approach A 20 kHz ultrasonic probe was used as the ultrasonic source. Ultrasound was applied through deionised water (DI) to sonochemically surface modify a high Tg epoxy laminate material (Isola...

...Christopher J. Caisse; John Coonrod; Allen F. Horn Purpose The purpose of this paper is to quantify the effects of thermal conductivity (TC), dielectric constant and dissipation factor (DF) of circuit laminates on the temperature rise with active components and RF trace heating. Design...

...Crystal P.L. Li; Paul Ciccolo; Dennis K.W. Yee Purpose The purpose of this paper is to present an overview of the alternative testing approaches that may be used to assess interconnect quality and their application to laminate material and plated‐through‐hole (PTH) process control. Design...

... what properties are considered desirable from a flexible circuit base material. There is no ideal flexible circuit laminate available today, however, there are a number of different criteria that can be used to define the desirable properties of such a laminate. Those properties encompass...

... to sample distance. Design/methodology/approach Ultrasound was applied through deionized water for the surface modification of three materials: a high Tg PCB laminate (Isola 370HR), a polyphenylene ether – polystyrene polymer (Noryl HM4025) and an acrylonitrile‐butadiene‐styrene/polycarbonate (Cycolac...

.../methodology/approach Methods to embed chips in flex include flip‐chip assembly and subsequent lamination, or the construction of a separate ultra‐thin chip package (UTCP) using spin‐on polyimides and thin‐film metallisation technology. Thinning and separation of the chips is done using a “dicing‐by‐thinning...

.... Equation 1 Equation 2 Equation 3 Equation 4 Figure 1 Cross section of a thermally stable laminate after forced decomposition Figure 2 T₂₈₈ and T ₃₀₀ graphs from the TMA Figure 3...

...Neil Patton Purpose This paper aims to show critical processing issues observed for the newer restriction of the use of hazardous substances compliant laminate materials. Design/methodology/approach Several samples of the popular lead‐free and halogen‐free laminate materials were tested under...

... and lower density. Originality/value The value of the paper lies in its ability to provide guidance on the critical base material properties. It describes the change in physical properties that laminates will see when moving up in temperature to facilitate lead‐free soldering. Selection criteria...

... studied. Finally, a technique for the lamination of the glass layers using low temperature, pressure assisted bonding was investigated. Findings Microvias with 100 μm diameter entry holes were successfully machined in 100 μm thick glass sheets and process windows were identified...

... laminate requirements in the context of increasingly stringent quality and performance criteria. Findings Low cost manufacturers in China supply a large proportion of the PCBs used by the European electronics industry. If this supply is to continue as board complexities and performance requirements...

...Bernd Hoevel; Ludovic Valette; Tomoyuki Aoyama Purpose To give an overview of the problems that can occur with base laminate materials when converting to lead‐free soldering and to give guidance on possible solutions. Design/methodology/approach The paper contains a number of correlations...

...Rudolf Wiechmann Purpose Peel strength numbers are part of a laminate's specifications and should characterize the specific bond performance (copper adhesion) under test conditions. Unfortunately, from both a theoretical and a practical point of view they are not able to do that. This study seeks...

... of TBBPA for laminate producers a real challenge. Although PCB manufacturers can find technical advantages (e.g. lower CTEs and better electrical values) in halogen‐free laminates, there is usually a cost penalty for the halogen‐free alternative, unless a halogen‐free material is specified by the final...

... test vehicle. Originality/value The value of the paper lies in its ability to provide insights into the prevention of fracturing of blind vias in a build‐up substrate through a novel numerical analysis using the submodeling technique. © Emerald Group Publishing Limited 2006 Laminates...

...Yih‐Rern Peng; Xiaolong Qi; Christos Chrisafides Purpose There are many considerations that have to be taken into account when balancing the properties epoxy‐based laminate and prepreg materials must have in order to meet the array of electrical, thermal and mechanical demands of today's...

...Taehoon Kim; Jee‐Soo Mok; Chang‐Kyu Song; Jun‐Heyoung Park; Kyung‐O Kim; Ben Sun; Byung‐Youl Min Purpose To review a newly developed PCB fabrication process based on a parallel lamination technique. Design/methodology/approach This paper has been written to introduce the SAVIA process, a new...

...Nikhil Verghese In the manufacturing process for making printed circuit boards (PCB) it is necessary to drill holes in the base copper clad laminate. This is a crucial step in the case of multi‐layer boards where the holes must be plated with copper to complete the electrical connection between...

... using our laminates, bond plys and cap layers manufactured from various melt‐point LCP dielectric films. This paper discusses the theory and practice of sequentially built multilayers in all‐LCP and mixed dielectric constructions, reviews the pertinent processing steps and guidelines necessary...