...Raghavendra Rao N.S.; Chitra A. Purpose The purpose of this study is to propose an extended reliability method for an industrial motor drive by integrating the physics of failure (PoF). Design/methodology/approach Industrial motor drive systems (IMDS) are currently expected to perform beyond...

...George Thiel; Flavio Griggio; Sanjay Tiku Purpose The purpose of this paper is to describe a novel methodology for predicting reliability for consumer electronics or any other hardware systems that experience a complex lifecycle environmental profile. Design/methodology/approach This Physics...

...Michael Pecht; Edmond Elburn Purpose The reliability of hard disk drives (HDDs) is dependent on the drive construction, as well as the operational and environmental conditions, in which the drive is used. Self-monitoring, analysis and reporting technology (SMART) continuously provides attribute...

... involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper...

...Clarissa Navarro Increasing board densities, decreasing spacing between holes and features and the growing requirement for printed circuit boards to perform in high temperature/high humidity environments have led to renewed concerns about possible reliability problems caused by the growth...

... Reliability In the past few years the research and development for wafer level chip scale packages (WLCSP) has become one of the most‐discussed issues in the IC packaging industry ( Garrou, 2000; Nguyen et al., 2000; Topper et al., 2000; Ahn et al., 2000; Mirza...

... Solder paste Reflow Underfill Reliability Modelling By the year 2006, 60 percent of all electronics systems will be portable and will require advanced interconnect technologies such as flip‐chip bonding (520 million ICs in 1996 and 7,500 million in 2006), in order to allow reduction in weight...

...Zhaowei Zhong This paper discusses processes of flip chip on FR‐4 using eutectic solder bumps with possible fewer process steps compared to the full assembly process. Some interesting results in terms of the reliability performance of flip chip on FR‐4 assemblies using eutectic solder have been...

... © MCB UP Limited 1999 --> Concoat Reliability Printed circuit boards Standards Launch of new industry standard for PCB reliability Keywords: Concoat, Reliability, Printed circuit boards, Standards Major failures in electronic circuitry, caused...

...Michael Carano While the interest in alternative metalization processes for the manufacturing of printed wiring boards is extremely keen, the long‐term reliability of plated through holes fabricated with these electroless copper alternatives remains in question. However, during the last three years...

... these defects are related to solderability issues, the mechanisms of failure due to defect‐induced failure accelerators, and the effect of the defect on solder joint reliability. © MCB UP Limited 1999 Defects Reliability Printed circuit boards Single‐sided Solders A large amount...

... to crack initiation and growth in the solder joints. Solder joint cracks have also been examined. Printed circuit boards Reliability Solder joints Surface finishing Environmental, processing and assembly issues are leading the printed wiring board industry to consider alternatives to hot air...

...Kazunari Nawa; Masakazu Ohkita Based on the superior properties of the COPNA resin laminate exhibiting Tg at 255∞C, small CTE at 5‐7 ppm (xy‐axis) and at 29 ppm (z‐axis), reliability of both two‐layered and six‐layered printed wiring boards using COPNA resin as a matrix were evaluated. In the case...

... that the presence of delamination did not significantly after the measurable moisture absorption characteristics of packages. Reliability testing indicated that although delamination is generally thought of as a reliability risk, it may not be a sufficient condition to promote damage in packages under dormant...

...S.‐W.R. Lee; J.H. Lau Computational stress analysis was performed in this study to investigate the solder joint reliability of plastic ball grid array (PBGA) packages with various configurations. The packages under investigation were 27 mm body‐size, 1.27 mm ball‐pitch, perimeter PBGAs...

...A. Shukla; M. Pecht; J. Jordan; K. Rogers; D. Jennings* The presence of hollow fibres in laminates used in printed circuit boards, multichip module laminated substrates, and plastic ball grid arrays has a potentially significant impact on reliability. Hollow fibres are vacuous glass filaments in E...