... 370 HR). The efficiency of the sonochemical surface modification process was determined by weight loss, roughness, adhesion and scanning electron microscopy (SEM). Findings This study has confirmed that ultrasound has the ability to surface modify a high Tg epoxy substrate material (Isola 370 HR...

... factors influencing “black pad” formation include immersion gold bath pH value, concentration of citrate and thickness of the immersion gold layer. In addition, copper substrate preparation is also important. Work to develop new metal deposition processes using ionic liquids has also been demonstrated...

... of testing. Further revisions of the feature geometry are required to implement an alternative MEA biochip that is suitably reliable. Research limitations/implications Basic photolithography techniques have been used to construct a base substrate for proof‐of‐principle studies. Increased sophistication...

...Fumin Song; Lianyu Fu; Fei Zhang Purpose The purpose of this paper is to present and describe a solution of aluminum substrate drilling. Design/methodology/approach The development of LED and printed circuit board with metal substrate are reviewed first. Then the challenges of drilling metal...

...Thomas Apeldorn; F. Wolff‐Fabris; V. Altstädt Purpose The purpose of this paper is to investigate and present the properties of a new substrate material based on thermoplastic polymers (so‐called LuVo Board) for high‐frequency applications. Design/methodology/approach The thermal, mechanical...

...X.C. Wang; H.Y. Zheng Purpose The purpose of this paper is to discuss laser cutting of FR4, and BT/Epoxy‐based PCB substrates with 355 nm DPSS UV laser. Design/methodology/approach The effects of various laser conditions such as scanning speed, assisting gas, repetition rate and interval...

... and are suitable for flexible PCB fabrication. Findings The use of these novel processes enables new types of microvias and multiple wire structures in the foils for millimeter wave circuitry of substrate integrated waveguides and shielding, as well as for sensors with high thermal resistance. Research...

..., electrochemical patterning by flow and chemistry, using a masked tool and fully exposed substrate. The micro patterns on the tool are replicated on the substrate via optimum design of the apparatus, choice of electrolyte chemistry and fluid flow. Findings Linear and square shapes ranging from 5 to 200...

...Xia Zhang; Johan Liu; Camilla Kärnfelt; Shiwei Ma; Xu Wang; Linqin Meng; Herbert Zirath Purpose Liquid Crystal Polymer (LCP) materials are considered to be promising substrates for wireless applications because of their excellent properties. The purpose of this paper is to describe now a novel...

...Markus Detert; Michael Zeise; Klaus‐Jürgen Wolter Purpose The purpose of this paper is to give an overview of the benefits and challenges of different technologies for via replacement in the realization of flexible substrates with more than one layer. Design/methodology/approach The paper...

...Sony Mathew; Michael Osterman; Michael Pecht; Frank Dunlevey Purpose The purpose of this paper is to present the results from work on a project aimed at evaluating six different copper alloy substrates coated with pure tin for tin whisker growth. The influence of intermetallic growth between...

...David A. Hutt; Karen Williams; Paul P. Conway; Fuad M. Khoshnaw; Xiaoyun Cui; Deepa Bhatt Purpose To present the aims and preliminary findings of a research project to investigate the manufacture of multilayer glass substrates built up from thin glass sheets. Design/methodology/approach...

...). Solder ball land diameter: 30mils (0.76mm). Solder mask opening for solder ball: 0.65mm. Single‐core two‐metal layer substrate. Cavity‐down design with heat spreader. Single split‐ring segments for power/ground wire bonding. Power/ground split via connection (SVC) or split wrap...

...S.‐W. Lee; J.H. Lau This paper presents a non‐linear numerical study to investigate the effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array(PBGA) packages. The package under investigation was a 225‐pin full‐grid PBGA assembly. The diagonal...