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Presents an overview of memory chip yield enhancement techniques by injection of fault tolerance. As memory chips are more prone to defects,the yield of good chips from a silicon wafer governs their production cost. As shown, most fault tolerance techniques assume a relatively large area overhead which results in additional costs in terms of the silicon used as well as the lower number of chips/wafers produced. Proper management of fault tolerance, as by the word redundancy approach, adds an almost negligible area overhead to the chip and leads to considerably higher yields.
© MCB UP Limited
1994
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