Effect of heat‐spreader sizes on the thermal performance of large cavity‐down plastic ball grid array packages ‐ NuCSP

The effect of heat‐spreader sizes on the temperature distribution, thermal resistance, and cooling power of a set of cost‐effective cavity‐down plastic ball grid array (PBGA) packages assembled on an FR‐4 epoxy glass printed circuit board (PCB) is presented. The sizes of these packages are 35 × 35mm and 40 × 40mm and with four and five rows of solder balls.