Issues

Appointments

Micronic Laser Systems appoints chief financial officer

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Palomar Technologies names Todd Wieseler manager of applications engineering

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Ray Cronin to lead Everett Charles Technologies semiconductor test group

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Erratum

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Erratum

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Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications

Ken Gilleo; Peter Ongley
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Analysis of packaging and sealing techniques for microelectronic modules and recent advances

P.K. Khanna; S.K. Bhatnagar; W. Gust
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Low cost prototyping of multichip modules ‐ the European INCO‐Copernicus project

Zsolt Illyefalvi‐Vitéz; Alfons Vervaet; André Van Calster; Nihal Sinnadurai; Marko Hrovat; Paul Svasta; Endre Tóth; Darko Belavic; Radu Mihai Ionescu; William Dennehy
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Towards a better understanding of underfill encapsulation for flip chip technology: proposed developments for the future

Ken Gilleo; Matthew Witt; David Blumel; Peter Ongley
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Low cost high‐density multilayer circuits for MCM‐C

I. Born; D. Detemmerman; M. Vrana; J. De Baets; A. Van Calster
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Interconnect solutions for advanced area array packaging

M.W. Hendriksen; F.K. Frimpong; N.N. Ekere
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Effect of heat‐spreader sizes on the thermal performance of large cavity‐down plastic ball grid array packages ‐ NuCSP

John Lau; Tony Chen
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Conference programme

IMAPS EUROPE '99. 12th European Microelectronics and Packaging Conference and Exhibition

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Editorial

The 12th European Microelectronics and Packaging Conference

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IMAPS diary

IMAPS diary

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IMAPS news

IMAPS UK

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IMAPS USA

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IMAPS Germany

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IMAPS Sponsors 12th Annual European Microelectronics Conference and Exhibition

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IMAPS Poland

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IMAPS Nordic

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IMAPS Brazil

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Industry news

Palomar Technologies expands presence in Europe

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Philips Semiconductors invests US$30 million to extend its Hamburg plant

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Air Products acquires majority interest in Korea's leading specialty gas equipment manufacturer for the semiconductor industry

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Zevatech forms new advanced transfer division

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Semi Dice announces kick-off of third annual bare die survey

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Palomar Technologies opens office in France

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Silway enters European ASSP and ASIC market with proven design and production facilities

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General Scanning Inc. and Lumonics Inc. announce agreement to merge

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International diary

International diary

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Internet commentary

After a search so painful, and so long

Brian Ellis
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New products

Fastflo numerical simulation software on UNIX

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Palomar upgrades ball bonders with LED-based lighting system and light calibration software

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First-ever zoom emission microscope combines speed and sensitivity

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Direct die feeder reduces packaging costs

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Third-generation 193nm tool introduced as part of industry roadmap for critical chip design technology

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Johnson Matthey Hydrogen Technology Group delivers hydrogen purifier units to Aixtron AG of Aachen, Germany

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Composite chips for efficient EMI/RFI filtering

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Schlumberger introduces ETC 1000 for breakthrough precision in test site thermal control

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Flip chip option now available with DB100 semi-automatic precision die bonder from Cammax Precima

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New microwave UV curing system

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New bond load option adds to flip chip bonder's versatility

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ECT expands wide bandwidth coaxial probe line

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Alternative pressing laminates (APL-D*) for producing sequential build-up multilayers

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Waterfall transducer provides acoustic coupling breakthrough

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Staubli Tec-Sem - management buy out

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ECT introduces expanded line of IC test probes

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Publications

Ablestik offers comprehensive adhesive shipping, handling and storage guide

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