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New impetus for microelectronics

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Prasad Nevrekar joins MRSI group as director of sales and marketing

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New sales manager for Menvier Hybrids

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Semi Dice announces four promotions

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An analysis of technology trends within the electronics industry

P.J. Palmer; D.J. Williams
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PAD design reliability for SMD passives

Milos Dusek; Ivan Szendiuch; Petr Szuscik
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Cure behavior of a no flow underfill encapsulant

D.T. Hsu; H.K. Kim; F.G. Shi; H.Y. Tong; S. Chungpaiboonpatana; C. Davidson; J.M. Adams
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Substrate integrated packaging for RF‐applications

H. Richter; D. Ferling; F. Buchali; W. Heck
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A new method for measuring signal integrity in CMOS ICs

Sonia Delmas‐Bendhia; Fabrice Caignet; Etienne Sicard
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Reliability of flip chip components soldered on FR5 board

Jarmo Määttänen; Petteri Palm; Aulis Tuominen
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A comparison of routing estimation methods for microelectronic modules

P.A. Sandborn; P. Spletter
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Conferences/exhibitions

IMAPS and Miller Freeman announce launch of HD International

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Editorial

Y2K, here we are!

Prof. Nihal Sinnadurai
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IMAPS diary

IMAPS diary

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IMAPS news

IMAPS USA

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IMAPS Japan

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IMAPS UK

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IMAPS Benelux

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Industry news

UV companies combine and launch latest in microwave curing

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The Nordic Electronics Packaging Guideline

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SEMI DICE announces two 'discrete' relationships

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Developers of the MP3 chip awarded innovation prize

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California Micro Devices opens European office

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International diary

International diary

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Internet commentary

Style is the dress of thought

Brian Ellis
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New products

MicroJoin Model 2000 delivers precision-controlled pulsed hot bar bonding capabilities in an integrated workstation

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Conductive film for MR/GMR head wafer fab

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Three chips stacked in one housing

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Dage launches new low-force wire pull tester

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High-speed, fully automatic screen printer for substrates, wafers and panels for solar cell production

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Quad launches first advanced packaging system to address needs of hybrid market while providing full SMT assembly capabilities

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Recommended reading for microelectronics technologists

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Enthone-OMl opens high volume copper manufacturing facility

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Speedline launches industry's only wafer printing system with integrated wafer handling robot

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Radiant technology unveils new wafer bump reflow oven

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New Murakami capillary film

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Expanded pupil microscope technology makes die bonding more efficient

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Pure silver flakes conduct electricity and heat

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Total solutions for the back end from datacon

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Technical brief

Discovering a heroic connection

Professor Nihal Sinnadurai
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