Issues

Appointments

Multi-Contact management change

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MnD appoints Ian Walsh as CEO

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Uprating of electronic parts to address obsolescence

Michael Pecht; Dave Humphrey
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Impact of environmental regulations on green electronics manufacture

Richard Ciocci; Michael Pecht
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Temperature dependence of silicon power MOSFETs switching parameters

R. Habchi; C. Salame; B. Nsouli; P. Mialhe
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Voltage mode multifunction OTA‐C biquad filter

K. Kumar; K. Pal
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Low voltage CCII‐based high performance cascadable multifunctional filter

T. Parveen; S.S. Rajput; M.T. Ahmad
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Application of artificial intelligence for the determination of package parameters for a desired solder joint fatigue life

K.O. Lee; K.E. Ong; K.N. Seetharamu; I.A. Azid; G.A. Quadir; T.J. Goh
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A study of aluminium wire failure in automotive under‐hood applications

Sung Yi; Sang Kyoo Park; Kiat Choon Teo
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Test chip and substrate design for flip chip microelectronic package thermal measurements

Teck Joo Goh; Chia‐Pin Chiu; K.N. Seetharamu; G.A. Quadir; Z.A. Zainal
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Exhibitions and conferences

Microtech 2006, iMAPS UK Technical Conference, Moeller Centre, Cambridge, March 7 and 8, 2006

J.H. Ling
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Industry news

Multiprocessor software specialist launches unified development platform for FPGAs and DSPs

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Nikon ships world's first production immersion system

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Daresbury move brings Norcott Technologies closer to Innovators

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SENSOR+TEST 2006 – the measurement fair

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Advance Nanotech Partners with Alps and Dow Corning Corporation to Finance New Wireless Research

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Quasicrystal technology to boost high-brightness LED market

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Bookham to highlight expanded high power laser diode portfolio at Photonics West 2006

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Pour encourager les autres: Microelectronics expands in France

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The conference programme for 2006

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Omron Electronic Components Business – Europe completes RoHS compliance process

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New focused web site developed to speed up the LabVIEW recruitment process

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Internet commentary

Internet commentary

Brian Ellis
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