Issues

Wire bonding using insulated wire and new challenges in wire bonding

Z.W. Zhong
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Experimental and numerical analyses of thick‐film piezoceramic structures for miniaturised sensors and actuators

Marina Santo Zarnik; Darko Belavic; Srecko Macek
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Critical issues, processes and solutions in ISFET packaging

Vinod Kumar Khanna
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High‐quality In0.47Ga0.53N/GaN heterostructure on Si(111) and its application to MSM detector

L.S. Chuah; Z. Hassan; H. Abu Hassan
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Geometrical, electrical and stability properties of thick‐film and LTCC microcapacitors

Edward Miś; Andrzej Dziedzic; Tomasz Piasecki; Jarosław Kita; Ralf Moos
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Reliability of wirebonds in micro‐electronic packages

W.D. van Driel; R.B.R. van Silfhout; G.Q. Zhang
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Micro solid oxide fuel cells and their fabrication methods

Piotr Jasinski
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Exhibitions and conferences

The IEEE ESTC Electronics Systems-Integration Technology Conference (ESTC)

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Industry news

ASML, Zeiss and Canon cross-license lithography equipment patent portfolios

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iSLI Research Engineer Wins "Student Engineer of the Year" award

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IPC issues report on microelectronics - who's driving and how to get there

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New start for Precision Micro

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Fujitsu Siemens computers selects LSI SAS/SATA RAID for new generation of PRIMERGY servers

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Fundamentals of microelectronics relates modern circuit design from a practical perspective

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MacGregor installs automated welding line for sensors

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New NanoMarkets report projects printed electronics market will reach $30.1 billion in 2015

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Photonium Oy aquires the majority shareholding in Akseli Lahtinen Oy

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LSI celebrates 60th anniversary of transistor manufacturer of first transistor donates replica to computer history museum

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Laird Technologies Inc. acquires Ezurio Ltd

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New breakthroughs in electronic inks by Dr Peter Harrop IDTechEx

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International diary

International diary

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New appointments

Carbon nanotube tool innovator names Director of Sales and Marketing

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New products

Intelligent optimisation tool makes design perfection an achievable reality for all electromagnetic equipment

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Fairchild Semiconductor introduces the industry's most integrated CCFL backlight inverter drive ICs for LCD backlight systems

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New Guide to Low Resistance Measurement from industry leader

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Air Semiconductor: first to bring instant and continuous location technology to portable devices

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Rutronik: octagonal design of the SIM-Connector from Amphenol-Tuchel Electronics offers more space

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Top ADC and DAC module goes industrial

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Z-Wave 400-series chips and modules provide superior platform for AV control plus enhanced home automation feature set

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Laird Technologies introduces T-lamT SS LLD laminate for Blu LED light engines

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LSI MegaRAID selected by IBM to power newest System X server line

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New air bearings from IBS Precision Engineering bring wide ranging benefits to UK machine builders

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Photo etching ... an enabling technology for miniaturisation

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Prism Sound's dScope Series III helps improve the quality of mobile phone audio

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Ocean Optics produces its fastest spectrometer yet

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