Issues

Appointments

Future Horizons signs up India affiliate

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Improved thermal stability of nitrogen annealed sputtered hafnium oxide thin films for VLSI technology

R.K. Nahar; Vikram Singh
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The effect of porosity on the properties of silicon solar cell

Asmiet Ramizy; Wisam J. Aziz; Z. Hassan; Khalid Omar; K. Ibrahim
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The effects of threading dislocations and tensile strain in Ge/Si photodetector

Jian‐hong Yang; Ying Wei; Xue‐yuan Cai; Jin‐zhi Ran
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Influence of process parameters on the substrate heating in direct current plasma magnetron sputtering deposition process

Jegenathan Krishnasamy; Kah‐Yoong Chan; Teck‐Yong Tou
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Effect of bismuth oxide thick film overlay on microstrip patch antenna

S. Patil; Vijaya Puri
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Experimental analysis of I‐V and C‐V characteristics of Ni/SiO2/4H‐SiC system with varying oxide thickness

Sanjeev K. Gupta; A. Azam; J. Akhtar
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Creating screen‐printed passive components for microwave applications

Osvaldo J. Arenas; Emilie Leynia de la Jarrige; François Boone
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3D LED and IC wafer level packaging

John Lau; Ricky Lee; Matthew Yuen; Philip Chan
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RF equivalent circuit modeling of surface mounted components for PCB applications

Aleksandar B. Menićanin; Mirjana S. Damnjanović; Ljiljana D. Živanov
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Conferences and exhibitions

IFS 2010Annual semiconductor industry forecast seminar

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Industry news

Conclusion of absorption-type company split agreement

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InterTech expands turnkey testing services to European automotive manufacturers

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TSMC holds topping ceremony for Fab 12, Phase 5

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GE, Philips, SNCF to present at world’s largest energy harvesting event

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Qualcomm and TSMC collaborating on 28 nm process technology

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International diary

International diary

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New products

Rutronik presents high-accuracy motion sensor from STMicroelectronics

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Cadence strengthens virtuoso custom IC design franchise leading EDA software for analog and mixed-signal design

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TSMC announces process technologies for integrated light emitting diodes drivers

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Wolfson launches world-leading high-performance audio solution

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Five new liquid electrolyte hydride sensors offer improved performance in demanding environments

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Cranfield develops revolutionary technology for manufacturing micro-scale devices

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Fairchild semiconductor’s new energy-efficient LED driver

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Molex introduces industry’s smallest SMT board-to-board connector

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Advanced digital signal processing application design will be a blast with new Xilinx Virtex 6 FPGA-based XMC and PMC boards

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Synopsys launches DesignWare HDMI 1.4 Tx/Rx controller and PHY IP solutions for 40 nm process technologies

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NXP launches LPCXpresso toolchain for LPC1100 Cortex-M0 family

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