Issues

Appointments

DEK Solar appoints new Solutions Engineer to drive alternative energy production start-ups

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Rutronik appoints new Marketing Directors in Passive and Electro-Mechanical Components

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Study of electrical characteristics of ZnO Schottky photodiode on Si substrate

L.S. Chuah; Z. Hassan; S.S. Tneh; S.G. Teo
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Design‐for‐reliability implementation in microelectronics packaging development

Liyu Yang; Rui Niu; Jinsong Xie; Bin Qian; Baishi Song; Qingan Rong; Joseph Bernstein
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The effect of low temperature thermal annealing on the properties of organic light‐emitting device

Chun‐lin Zhang; Yong Zhang; Fang‐cong Wang; Ying Wei; Xiao‐yun Jia; Su Liu
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Functional room temperature metal (Al or Pd)‐ZrO2 (smooth or porous surface)‐Si MOS capacitor O2 sensor

Mun Teng Soo; Kuan Yew Cheon; Ahmad Fauzi Mohd Noor
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A sequential triggering technique in cascaded current source for low power 12‐b D/A converter

Zhi‐Yuan Cui; Ho‐Yong Choi; Tae‐Won Cho; Nam‐Soo Kim
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Evaluation of the electrical properties under extreme stress in photovoltaic solar modules

J. Sidawi; N. Abboud; G. Jelian; R. Habchi; C. Salame
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Influence of Mg2+substitution on the magnetic and electrical properties of Li‐Zn ferrite thick films synthesized with PVA matrix

M.K. Rendale; S.D. Kulkarni; D.C. Kulkarni; Vijaya Puri
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A novel application of planar‐type meander sensors

Snezana M. Djuric; Laszlo F. Nagy; Mirjana S. Damnjanovic; Nikola M. Djuric; Ljiljana D. Zivanov
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Temperature cycling analysis for ball grid array package using finite element analysis

Muhammad Nubli Zulkifli; Zul Azhar Zahid Jamal; Ghulam Abdul Quadir
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Conferences and exhibitions

The 5th Annual IeMRC Conference,Holywell Park Conference Centre,Loughborough University, 21 September 2010

John Ling
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Printed Electronics – Technologies and Applications, Electronics Yorkshire, 23 September 2010

Pete Starkey
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Forthcoming events

Forthcoming events

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Industry news

Open-silicon integrates 50 DesignWare interface and analogue IP products with 100 percent silicon success

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The NanoKTN and University of Surrey announce funding scheme to encourage interaction between industry and academia

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TSMC begins building solar R&D centre and Fab in central Taiwan

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Semiconductor research gets £10 million boost

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Fab owners association membership reaches 63 members

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High-value MEMS are projected to reach US$1.6 billion in 2010, up 29.7 percent from US$1.2 billion in 2009

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Melexis to chair DASH7 Automotive Working Group

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RFID transforms customer service, retailing and consumer goods

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NXP selected to secure new German national identity card

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Camtek receives order for multiple wafer inspection systems

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New products

Fairchild semiconductor’s high voltage gate driver ICs provide improved noise immunity and performance

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Renesas electronics announces support for the Microsoft.NET Micro Framework 4.1 on its SH-2/SH-2A microcontroller series

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Summit’s tiny programmable single and dual integrated buck regulators support “Green” standards in multimedia consumer electronics

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Wolfson announces ultra low power audio hub solution for portable digital audio applications

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Modular multi-pole bayonet connectors support versatile, high-performance data links

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Geotest expands PXI digital product line with two new high-performance digital instruments

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Note from the publisher

A new company descriptor takes us into a new era

Rebecca Marsh
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