Issues

Analysis of dark current dependent upon threading dislocations in Ge/Si heterojunction photodetectors

Structural and impedance spectroscopy study of Al‐doped ZnO nanorods grown by sol‐gel method

A new time‐dependent mobility degradation model for MOS transistors

Finite element modeling of channel sag in LTCC

Analysis of warpage and residual stress in plastic ball grid array package after post mold cure

A dual‐band voltage‐controlled oscillator in 0.13 μm CMOS technology

IeMRC plastic and printed electronics

Printed electronics 2012 Berlin, Germany 3-4 April 2012

Synopsys, Altera and TSMC collaborate to deliver Silicon-accurate parasitic modeling and extraction for 28-nm processes

TSMC expands investment in Taiwan with new milestone for Taichung GigaFab

Renesas Electronics honoured with Siemens Supplier Award in the “Special Recognition” Category

Camtek receives orders in excess of $3.5 Million for its backend semiconductor inspection tools from a leading global OSAT

Thinfilm Wins IDTechEx Product Development Award for World’s First Printed Addressable Memory

International diary

Camtek launches Phoenix: its next generation AOI system for the PCB and IC substrates industry

Viscom develops an innovative 3-D MID inspection system

Fairchild Semiconductor and Infineon Technologies expand compatibility partnership for power MOSFETs, providing customers supply chain security

Renesas Electronics introduces new V850 microcontroller (MCU) series with very low-power consumption and high functionality for body applications in the automotive segment

Latest Synplify FPGA synthesis software offers new high reliability features and improves productivity for FPGA based prototyping

Altera and TSMC jointly develop world’s first heterogeneous 3-D IC test vehicle using CoWoS process

Multitest leverages MT9510×16 for quad-site MEMS applications

Cadence delivers high-performance, low-power design IP supporting LPDDR3 memory standard