Issues

Non‐destructive quantitative phase analysis of an LTCC material

Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

Growth of InN thin films on different Si substrates at ambient temperature

Potentiality of polysilicon nanogap structure for label‐free biomolecular detection

Microwave studies by perturbation of Ag thick film microstrip ring resonator using superstrate of bismuth strontium manganites

Thick film screen printed environmental and chemical sensor array reference electrodes suitable for subterranean and subaqueous deployments

Thermal resistance studies of surface modified heat sink for 3W LED using transient curve

Semiconductor Industry Forecast Seminar 2013London, 22 January

NanoKTN held their first Nanotechnology in Medical Devices event in London

Molex receives Delphi’s Pinnacle Awards for Supplier Excellence

Tiny compound semiconductor transistor could challenge silicon’s dominance

Imec and Synopsys expand FinFET collaboration to 10 nm geometry

Hemlock Semiconductor announces layoffs, reduces production as a result of industry oversupply, international trade disputes

How ‘transparent’ is graphene?

Cadence Encounter Technologies enable Open-Silicon to reach 2.2 GHz performance on 28 nm ARM dual-core Cortex-A9 processor

Cogiscan invests in technological innovation

International diary

EAS’ new digital position sensor offers contactless measurement of magnetic field fluctuations

Fairchild Semiconductor’s high-voltage MOSFETs provide industry-leading robust body diode performance in AC-DC power applications

Atotech’s new clean rooms for semiconductor production

MEMS oscillators – great growth potential and superior performance

Engineered Material Systems introduces new low-temperature cure die attach

Fairchild Semiconductor’s Dual Cool™ package improves power density and performance in DC-DC power applications