... in junction temperature (T_J) are critical parameters. The purpose of this work is to evaluate the R_th and T_j of the LED attached with the modified heat transfer area of the heatsink to improve thermal management. Design/methodology/approach...

... duration. Kah‐Yoong Chan can be contacted at: kychan@mmu.edu.my © Emerald Group Publishing Limited 2010 Substrates Heat transfer Vaporization Vapours Physical vapor deposition (PVD) is a deposition process in which a thin film of material is deposited on a substrate using vapor...

... for thermal management in electronic systems. Research limitations/implications Limited to cases where the correlations for heat transfer coefficients are valid. Practical implications A very useful finding for practising thermal engineer especially in the area of electronic packaging...

..., and a thin layer (0.127 mm) of interface material between them. Detailed dimensions of the model are described in Table II . The effect of the heat sink was modeled using the convection heat transfer coefficient, h=575 W/m² K, applied to the exposed surface of heat sink...

... © MCB UP Limited 2000 --> ORCUS Film Heat transfer Keywords ORCUS, Film, Heat transfer ORCUS Inc. has announed the immediate availability of Super FSF-52 Free Standing Film, the latest addition to the Thermaphase line of thermal interface materials. The new material...