...Adama Samake; Piotr Kocanda; Andrzej Kos Purpose This paper aims to present an effective approach to integrated circuit (IC) throughput enhancement, called TΔT thermal control. It does not require any micro-architectural change of the IC. The only modification is the attachment of an additional...

... on either N_F or W_F only. Siti Maisurah Mohd Hassan can be contacted at: maisurah@tmrnd.com.my © Emerald Group Publishing Limited 2014 CMOS Integrated circuits Maximum oscillation frequency Millimeter-wave Radio frequency Transistor Finger...

... to the current source circuit to maintain an acceptable voltage level across transistors Mn4 to Mn9 during any operation of the VCO. Siti Maisurah Mohd Hassan can be contacted at: maisurah@tmrnd.com.my © Emerald Group Publishing Limited 2012 Oscillators Integrated circuits...

... be contacted at: ouni_bouraoui@yahoo.fr © Emerald Group Publishing Limited 2012 Integrated circuits Programming and algorithm theory Micro‐circuit technology Multi chip modules New FPGA families can be reconfigured partially, meaning that only a certain portion of the chip area...

... to 16 mm) between both coils. The generic block diagram of a wireless neural stimulation microsystem is shown in Figure 1 (Maysam and Khalil, 2004). The internal part, which can be designed as an integrated circuit (IC) except for the receiver tank circuit, can be made small enough...

...Franciszek Balik Purpose The purpose of this paper is to present a new method of optimization of electronic integrated circuits (IC) with imbedded passive modules (PM). The reported method constitutes an attempt to streamline the optimization process in the AC electrical model stage of the RF...

... implies that a chip can have both top and bottom sides with circuits as shown in Figure 5 . This opens the doors wide for many innovative applications. Microvias Microprocessor chips Integrated circuits The electronics industry has been the largest industry since 1996 and would...

...John Lau; Ricky Lee; Matthew Yuen; Philip Chan Purpose The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach These packages consist of the multi‐LEDs and active IC chip such as the application...

... OPA1; V_off2 an offset of the opamp OPA2; and Err_RDIV a relative error of the resistor divider. Electrochemical devices Sensors Integrated circuits The electrochemical analysis is one of everyday tools commonly used in many laboratories...

..., respectively. Oscillators Induction Integrated circuits Radiofrequencies Owing to the inherent property of the IEEE 802.1e‐based mobile WiMAX technology with long‐transmission distance and high‐date rate, it had become attractive to this generation (Kuo et al., 2008). The WiMAX...

... a core‐based design approach, which can also deliver multi‐band radio frequency integrated circuit. Findings A fabricated 3.5 GHz MPA achieved a P1dB of 16.81 dBm, power‐added efficiency (PAE) of 16.74 percent and gain of 6.81 dB at the 10 dBm of input power under a low‐power supply of 3 V...

... engineering Packaging materials Integrated circuits Fracture Composite materials Thermal expansion Figure 3 shows the relation of microhardness with the volume fraction of silicon particle. The hardness of Al‐Si/SiC composite material increases with increasing the volume fraction of silicon...

... is a parameter to be extracted (Annada Prasad Sarab and Dasgupta, 2005) can be empirically derived constants. S. Dasgupta can be contacted at: sudebfec@iitr.ernet.in © Emerald Group Publishing Limited 2009 Electric current Temperature measurement Integrated circuits Double gate (DG...

... The paper proposes a SRAM cell to reduce the power in write “0” as well as write “1”operation by introducing two tail transistors. C.M.R. Prabhu can be contacted at: c.m.prabu@mmu.edu.my © Emerald Group Publishing Limited 2009 Integrated circuits Power transistors The power...

... that in interconnect, signal delay, power consumption and crosstalk are all affected by load variations in a coupled neighboring interconnect. © Emerald Group Publishing Limited 2009 Circuit properties Electrical components Integrated circuits Electrical load Figure 8 shows coupled interconnect...

... Emerald Group Publishing Limited 2009 Integrated circuits Voltage Signal processing Four‐quadrant analog multipliers are very useful building blocks in many circuits such as adaptive filters, frequency‐shifters, modulators, convolvers, curve fitting generators. It is also applied...

... impedance as a result of negative feedback, while the good frequency characteristic is preserved due to its simple core structure. However, the output swing is still limited to two overdrive and two gate‐source voltages. Integrated circuits Simulation Voltage followers play a crucial role...

... by the increase of its reverse current. R. El Bitar can be contacted at: ronybitar5@hotmail.com © Emerald Group Publishing Limited 2009 Integrated circuits Product reliability With the technological advances in the sciences of materials (  Jharia et al., 2008...

... had been utilized in generating a low phase and amplitude error in phase and quadrature phase LO frequency (Ramiah and Zulkifli, 2007). © Emerald Group Publishing Limited 2007 Integrated circuits Low voltage Local area networks Increasing demand for higher capacity...

... of interconnects are given, and a comprehensive study of the impact of weight factor on the optimized results under two scenarios is presented. Optimization techniques Wires Integrated circuits With the decrease in feature size of deep sub‐micron (DSM) integrated circuit, global interconnect...