...Xionghui Cai; Aixia Zhai; Chenglong Zhou; Kyung-Wook Paik Purpose The purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system...

... test results. And, the radiation hardening design is evaluated by the simulation method. Findings The experimental results demonstrate that the S21 curve of the interconnection decreases with the increase of the irradiation dose, indicating that the total dose effect leads to the decline of its...

...H. Ymeri; B. Nauwelaers; K. Maex; D. De Roest New analytical approximation for the frequency‐dependent impedance matrix components of symmetric VLSI interconnect on lossy silicon substrate are derived. The results have been obtained by using an approximate quasi‐magnetostatic analysis of symmetric...

... © MCB UP Limited 2003 --> Interconnection Ganged RF system for Molex Keywords: Interconnection Molex Incorporated has unveiled a new innovative ganged RF interconnect system providing ultra- reliable high bandwidth single ended or analogue RF signal connections...

...G.J. Carchon; W. De Raedt; E. Beyne High Q on‐chip inductors and low loss on‐chip interconnects and transmission lines are an important roadblock for the further development of Si‐based technologies at RF and microwave frequencies. In this paper, inductors are realized on standard Si...

...Daniel T. Rooney; N. Todd Castello; Mike Cibulsky; Doug Abbott; Dongji Xie The mechanical integrity of solder joint interconnects in PWB assemblies with micro ‐ BGA, chip scale, and LGA packages are being questioned as the size and pitch decrease. Three‐point cyclic bend testing provides a useful...

...Arun Chandrasekhar; Eric Beyne; Walter De Raedt; Bart Nauwelaers; Tania Van Bever This paper highlights the electrical behaviour of the interconnects on a 120‐pin Ball Grid Array (BGA) package from 500 MHz upto 8 GHz. The measurements are made using IMEC's MCM‐D thin film technology...

...H. Ymeri; B. Nauwelaers; K. Maex In this paper a method for analysis and modelling of transmission interconnect lines with zero or nonzero thickness on Si–SiO₂ substrate is presented. The analysis is based on semi‐analytical expressions for the frequency‐dependent transmission line...

...Eric Beyne; Rita Van Hoof; Tomas Webers; Steven Brebels; Stéphanie Rossi; François Lechleiter; Marianna Di Ianni; Andreas Ostmann A novel interconnect technology, introducing thin film on a laminate substrate base, is presented. A specially constructed laminate board is used as a substrate...

...Hasan Ymeri; Bart Nauwelaers; Karen Maex; David De Roest A new method for analysis of IC interconnects propagation parameters is suggested. A potential integral formalism is employed that enables us to express general solutions for the scalar potential in each layer of a multilayer model...

... © MCB UP Limited 2000 --> Atmel CS2 Partnering Interconnection Thin film Atmel and CS2 agree to develop interconnect technology for multi-element integration Keywords Atmel, CS2, Partnering, Interconnection, Thin film Atmel Corporation and CS2 have announced...

... PowerBGA 3.5 is now available with prices ranging from $22,000-$37,000. For further information, please contact: Alisa Popolizio, PADS Software, Inc. Tel:+1 (508) 357 8119; E-mail: alisap@pads.com © MCB UP Limited 2000 --> PADS Software Interconnection Automation...

...Philip Pieters; Walter De Raedt; Eric Beyne The thin film multilayer multichip module technology (MCM‐D) was originally used for the interconnection of high speed digital circuits in a single module. Nowadays, the technology is more and more evolving towards use in the interconnection of RF...

..., the full potential of area array attach can only be realised if the next level of interconnect is capable of supporting the fine pitch and high I/O characteristics of emerging CSP and flip chip technology. Celestica has addressed this issue by investigating next generation printed circuit board (PCB...

...Peter Moran In order for system designers to make full use of the successive generations of semiconductor devices it is becoming increasingly necessary to choose interconnection systems that are tailored to the application. As this trend becomes more pronounced, the limitations of traditional...

... of two adjacent lines, under a given voltage potential. These operational conditions are often met in the interconnection line buses, placed in the top assembly level of multilayered hybrid structures. The subject of investigations are MCM(D) developed on Al‐sheet carrier with internal conducting...

... for production of substrates including electronic interconnections, vias and resistive groups. They can serve for MCMs due to the specific features of Al. The technological process includes first electrochemical oxidation of Al‐sheet as base isolation layer Al₂O₃ (50‐70μm...

... frequencies and, when carefully designed, can also be used for opto‐electronic interconnections in the GHz range. A test module for DC and HF characterisation has been designed and produced. Preliminary test results are presented. An SEM photograph of a 100μm wide wet/dry etched via is shown...

... the first process and identical test modules were provided by the supplier using the second technology. The design of the test module is based on a two‐layer interconnection pattern including structures for testing cross‐overs, via interconnections with various resolutions (down to 50 μm via size), in order...

...U.P.I. Pedersen; O. Aaserud; O.W. Bungum This paper describes the processing and electrical characterisation of an interconnection substrate technology called Combifilm. The study focuses on digital applications. According to calculations, the conductivity of the reference plane is shown...