...Muna Ezzi Raypah; Shahrom Mahmud; Mutharasu Devarajan; Anoud AlShammari Purpose Optimization of light-emitting diodes’ (LEDs’) design together with long-term reliability is directly correlated with their photometric, electric and thermal characteristics. For a given thermal layout of the LED...

.... , Burns , P.L. and Holmes , A.B. (1990), “ Light‐emitting diodes based on conjugated polymers ”, Nature , Vol. 347 , p. 539 . Chan , I.M. and Hong , F.C. (2004), “ Improved performance of the single‐layer and double‐layer organic light emitting diodes by nickel oxide coated...

...John Lau; Ricky Lee; Matthew Yuen; Philip Chan Purpose The purpose of this paper is to propose new 3D light emitting diodes (LED) and integrated circuits (IC) integration packages. Design/methodology/approach These packages consist of the multi‐LEDs and active IC chip such as the application...

...E. Eisermann; K. Höll; W. Smetana; W. Tusler; M. Unger; J. Whitmarsh Purpose The purpose of this paper is to describe two new thick film paste systems (one glass‐based and the other polymer‐based) for insulating aluminium substrates and allowing components like high‐intensity light‐emitting diodes...

...N. Aizar Abdul Karim; P.A. Aswatha Narayana; K.N. Seetharamu Purpose To demonstrate thermal modeling technique for a through hole light emitting diode (LED) package using a commercial computational fluid dynamic (CFD) code and to improve its thermal performance through a series of sensitivity...