... electrical signals using experimental and simulation methods. Design/methodology/approach This work carries out the irradiation test of the specimens and measures their S21 parameters before and after irradiation. A simulation model describing the total dose effect was built based on the experimental...

... in the graph of Figure 8 . Goran J. Radosavljević can be contacted at: rgoran@uns.ac.rs © Emerald Group Publishing Limited 2010 Vibration Sensors Sensitivity analysis Modeling Simulation The considered sensor operating principle is based on a passive resonant LC circuit. Sensors...

.... The purpose of this paper is to propose an RC thermal model of the dynamic electro‐thermal behavior of IGBT pulse width modulation inverter modules. Design/methodology/approach The electrothermal model has been implemented and simulated with a MATLAB simulator and takes into account the thermal influence...

... , p. 219 . In this paper, the performance of the Ge vertical p‐i‐n photodetectors on Si substrate is investigated considering the influences of the tensile strain and the TDs in the Ge epitaxial layer. The simulated results for the dark currents, photo responsivities and time responsivities...

... CMOS technology, and operates under the supply voltage of 1.5 V. HSPICE is used to verify the circuit performance. Findings The simulations show output voltage swing of ±0.6 V (300 Ω load) with the total harmonic distortion of 0.55 per cent at the operating frequency of 3 MHz. The bandwidth...

... locations which can help the designer to perform the thermal analysis much faster and easier with the required accuracy. The first step of generating a CTM of a package is simulating the thermal behavior of the package by thermal simulation software. Although different approaches for thermal analysis...

...Kaiçar Ammous; Slim Abid; Anis Ammous Purpose The paper aims to focus on the semiconductor temperature prediction in the multichip modules by using a simplified 1D model, easy to implement in the electronic simulation tools. Design/methodology/approach Accurate prediction of temperature...

...Brendan O'Flynn; D. Laffey; J. Buckley; J. Barton; S.C. O'Mathuna Purpose This paper aims to describe the simulation, design, development and characterisation of antennas for wireless sensor networks operating in a variety of environments, including an under water submarine application and more...

... of 50 ps. The simulations are run for interconnect length of 2 and 4 mm. These parameters are varied for four different cases of stimulations to aggressor and victim lines viz. V_A (input at aggressor node A) and V_B (input at victim node B) switching in same...

... the proposed realization has many attractive features such as low component count, high‐Q, low sensitivity performance, independent Q‐tuning of the filter without affecting its pole frequency. Originality/value Simulation results show excellent performance with low power consumption of 1.87 mW at ±2.5...

... analyses. Design/methodology/approach Thermal resistance of the standard through hole LED is calculated using the simulation result. The result is then compared with actual measurement to establish the correct model. Using the validated model, series of sensitivity analyses are carried out through...

...‐dimensional device simulation has been used, to examine the effect lateral dual sidewall Schottky concept on the current‐voltage characteristics of a lateral Schottky rectifier on silicon‐on‐insulator. The Schottky contact consists of a low‐barrier metal and a high‐barrier metal. Findings Results show...

...Rajeevan Chandel; S. Sarkar; R.P. Agarwal Purpose In this short communication, transition times of input signals for various stages of a repeater‐chain loaded VLSI interconnects are studied. Design/methodology/approach SPICE simulations. Findings It is observed that for a fixed number...

...Sukhendu Deb Roy; M. Jagadesh Kumar Purpose The main purpose of this paper is to find a simple method to improve the breakdown voltage of BJTs fabricated on SOI. Design/methodology/approach We have used two‐dimensional device simulation to examine the effect of a collector tub on the collector...

... © MCB UP Limited 2001 --> Conferences Simulation Microelectronics EuroSimE 2001 – 2nd International Conference Keywords: Conferences, Simulation, Microelectronics 9-11 April, Paris, France Among the technology trends of the electronics industry...

.... However, resistors and, to a lesser extent, inductors are heat generating devices, and the temperature developed within PCBs as the result of the operation of embedded passives is a significant aspect of the design of a multilayer PCB. Here we investigate, by simulation, temperature fields associated...