Issues

Appointments

Appointments at PMJ

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DEK expands German application department

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Quad announces three promotions

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MYDATA announces three new appointments

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Book reviews

Supply chain management shifts to contract manufacturers

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Workbook coaches electronics companies in outsource decision

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Conductive Adhesives for Electronics Packaging

Brian Ellis
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An Engineer's Handbook of Encapsulation and Underfill Technology

Brian Ellis
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Lead‐free solders in Japan (a personal impression)

W.J. Plumbridge
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A novel high performance die attach

X.M. Xie; T.B. Wang; J.Z. Shi; R.Q. Ye; F. Stubhan; J. Freytag
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Investigation of a solder bumping technique for flip‐chip interconnection

David A. Hutt; Daniel G. Rhodes; Paul P. Conway; Samjid H. Mannan; David C. Whalley; Andrew S. Holmes
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Reliability of unencapsulated SMD plastic film capacitors

Anne Seppälä; Kimmo Saarinen; Eero Ristolainen
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An alternative approach for the analysis of intermetallic compounds in SMT solder joints

I.K. Hui; H.W. Law
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3D Si‐on‐Si stack packaging

H. Kanbach; J. Wilde; F. Kriebel; E. Meusel
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Conference report

EM&T/OnBoard Seminars 1999 - another successful year, come on 2000!

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SMTA International Conference and Exhibition

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Exhibitions and conferences

Productronica 99 provides industry boost

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NEPCON West conference enhanced with new sessions and special events

Trevor Galbraith
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NEPCON/Microelectronics Shenzhen '99 concluded with encouraging responses

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Buzz Aldrin to deliver opening keynote address at NEPCON West 2000

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Industry news

$440 million agreed for phasing out developing country CFCs

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M-Factor paste proves decisive for Siemens

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ATF acquires equity interest from Speedline

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Test Connections announces purchase

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PMJ acquires Salon Hannu Seppälä OY

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OK International announces acquisition of Semtronics Corp.

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Siemens AG and Fabmaster S.A. have signed an OEM agreement

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Tamura Kaken Japan receives Telcordia Technologies certification for Solder Paste NC 7

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ESEC and Juki Automation Systems sign agreement on transfer of CBA business

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Flextronics International and the Dii Group sign merger agreement

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Mask Tek awarded patent

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PAF announces management buyout and expansion plan

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DEK and photo stencil form global alliance

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Philips and Yamaha extend SMT partnership

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PMJ acquires Cencorp's depaneling technologies

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Fujitsu Siemens Computers to outsource server production in Paderborn to Flextronics International

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Industry specialists join forces to resolve the technical challenges in electronics manufacturing

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Philips EMT and CIMCIS partner to help customers optimize pick-and-place machine setup and operation

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EKRA expands international presence

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Institute news

NPL receives research and development award

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NPL Electronics Interconnection Group publications

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IPC estimates EMS sales rose 21.5 percent in 1999

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NPL. The lead-free soldering cook book

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NPL. IPC honours NPL scientist Chris Hunt

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SMTA International 2000 moves to the windy city

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APEX tutorials to focus on SMT, advanced component packaging

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NEMI to launch Roadmap 2000 at APEX SM

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NPL. NPL shows the way on lead-free soldering

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NPL. NPL launches SSTC Web page and announces upcoming events

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ITRI's Kay Nimmo wins Best International paper at IPCWorks

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IPC, NEMI team to standardize factory and supply chain communication

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TWI. The REACT Network Club launch

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SSTC. 20th Anniversary Seminar Meeting at NPI

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ITRI launches lead-free solder centre of excellence

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New online feature - practical solutions forums

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Lead-free electronics talks bring large crowds to IPCworks

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NPL. NPL launches Visual Inspection Guidelines on CD-ROM

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NPL. New issue of NPL Microelectronics News

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APEX keynote to focus on supply chain management

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International diary

International diary

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Internet commentary

By just exchange one for the other giv'n 1

Brian Ellis
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New products

Heraeus introduces lead- and halide-free no-clean solder paste

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New adhesives: for Iow-temp cure without trade-offs and ultra high-speed dispensing

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PMJ Cencorp expands product line with new low-cost depaneling system

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PMJ's launches HiSAC 1502 final assembly cell

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Speedline CAMALOT enters sphere placement market with new Matrixx&#153 system

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New manual dispensing guns from Intertronics - low cost, operator friendly, versatile

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New reflow ovens provide improved operating process and low maintenance

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New micro grabbers for fine pitch IC testing

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Excellon automation announces first depanelization line

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JOT Automation introduces mobile phone test handlers for both PCB and final testing

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GenRad announces availability of Shop Floor Line Manager software

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GraphiCode introduces GC-PLACE 4.1.2 for Windows&#153

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The new high-end EKRA E4 stencil printer sets milestones in the industry-wide price-performance ratio

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Powerful

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Further enhancements to Speedline MPM's Rheometric Pump

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New, easy-to-use Quad operating software

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Speedline Electrovert launches aqueous cleaner

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Electronic clip art CDs from Bob Willis

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Heraeus launches a new cleaner for removing flux residues from reflow ovens and wave solder machines

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Valor releases version 5 of Enterprise 3000 and Trilogy 5000 CAD/CAM systems

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New solderpastes: high-speed, fine pitch and lead-free

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Speedline ACCEL's new MicroPro&#153 integrates the reflow and cleaning process

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New climate test chambers from Montford

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Siemens replacement pick and place vacuum nozzles introduced

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SMART news

Nepcon and the SMART Group announce process technology seminars

Philip J. O'Rourke
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SMART adhesives day

Philip J. O'Rourke
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Advance information from the SMART Group

Philip J. O'Rourke
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The SMART Group launch new brochure

Philip J. O'Rourke
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The SMART Group Ireland Industry Awards 1999

Philip J. O'Rourke
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Obituary - Declan Clear

Philip J. O'Rourke
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Dr Colin Lee OBE marries Deborah White

Philip J. O'Rourke
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