Issues

Appointments

DEK's Neil MacRaild named Americas General Manager

View articletitled, DEK's Neil MacRaild named Americas General Manager
Add to Citation Manager for DEK's Neil MacRaild named Americas General Manager

Henkel promotes Giuseppe Caramella to Product Manager for Europe

View articletitled, Henkel promotes Giuseppe Caramella to Product Manager for Europe
Add to Citation Manager for Henkel promotes Giuseppe Caramella to Product Manager for Europe

Book Review

Handbook of Thick Film Technology – 2nd edition

Brian Ellis
View articletitled, Handbook of Thick Film Technology – 2nd edition
Add to Citation Manager for Handbook of Thick Film Technology – 2nd edition

The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

Meng‐Kuang Huang; Chiapyng Lee; Pei‐Lin Wu; Shyh‐Rong Tzan
View articletitled, The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints
Open the PDF for in another window
Add to Citation Manager for The effects of surface finish on the reliability of lead free and tin lead chip scale package solder joints

The effect of thermal cycling on the contact resistance of anisotropic conductive joints

L. Ali; Y.C. Chan; M.O. Alam
View articletitled, The effect of thermal cycling on the contact resistance of anisotropic conductive joints
Open the PDF for in another window
Add to Citation Manager for The effect of thermal cycling on the contact resistance of anisotropic conductive joints

Solder joint reliability in AgPt‐metallized LTCC modules

Olli Nousiaianen; Risto Rautioaho; Kari Kautio; Jussi Jääskeläinen; Seppo Leppävuori
View articletitled, Solder joint reliability in AgPt‐metallized LTCC modules
Open the PDF for in another window
Add to Citation Manager for Solder joint reliability in AgPt‐metallized LTCC modules

Effect of SnAgCu composition on soldering performance

Benlih Huang; Arnab Dasgupta; Ning‐Cheng Lee
View articletitled, Effect of SnAgCu composition on soldering performance
Open the PDF for in another window
Add to Citation Manager for Effect of SnAgCu composition on soldering performance

Application of a design of experiments approach to the reliability of a PBGA package

Ji Hyuck Yang; Kang Yong Lee
View articletitled, Application of a design of experiments approach to the reliability of a PBGA package
Open the PDF for in another window
Add to Citation Manager for Application of a design of experiments approach to the reliability of a PBGA package

Exhibitions and conferences

NEPCON 2005

John Ling
View articletitled, NEPCON 2005
Add to Citation Manager for NEPCON 2005

Industry news

DfR Solutions and Interface Sciences Corporation team up to provide solutions for conductive anodic filament (CAF) formation and Pb-free reflow

Dr Craig Hillman
View articletitled, DfR Solutions and Interface Sciences Corporation team up to provide solutions for conductive anodic filament (CAF) formation and Pb-free reflow
Add to Citation Manager for DfR Solutions and Interface Sciences Corporation team up to provide solutions for conductive anodic filament (CAF) formation and Pb-free reflow

Accelonix expands with three new distributor deals for the UK

View articletitled, Accelonix expands with three new distributor deals for the UK
Add to Citation Manager for Accelonix expands with three new distributor deals for the UK

International diary

International diary

View articletitled, International diary
Add to Citation Manager for International diary

Internet commentary

Internet commentary

Brian Ellis
View articletitled, Internet commentary
Add to Citation Manager for Internet commentary

Interview

New chairman for iMAPS UK

View articletitled, New chairman for iMAPS UK
Add to Citation Manager for New chairman for iMAPS UK

New products

Pb-free screen printing study recommends more nickel in future stencils

View articletitled, Pb-free screen printing study recommends more nickel in future stencils
Add to Citation Manager for Pb-free screen printing study recommends more nickel in future stencils

Henkel Corporation introduces new conductive adhesive for die attach applications

View articletitled, Henkel Corporation introduces new conductive adhesive for die attach applications
Add to Citation Manager for Henkel Corporation introduces new conductive adhesive for die attach applications

Contax announces the next generation of network compatible AOI

View articletitled, Contax announces the next generation of network compatible AOI
Add to Citation Manager for Contax announces the next generation of network compatible AOI

Intertronics launch lightweight, cordless electric hand-held dispenser

View articletitled, Intertronics launch lightweight, cordless electric hand-held dispenser
Add to Citation Manager for Intertronics launch lightweight, cordless electric hand-held dispenser

Contax launches C5 placement systems

View articletitled, Contax launches C5 placement systems
Add to Citation Manager for Contax launches C5 placement systems

Henkel Corporation introduces several innovative liquid fluxes for today's most demanding applications

View articletitled, Henkel Corporation introduces several innovative liquid fluxes for today's most demanding applications
Add to Citation Manager for Henkel Corporation introduces several innovative liquid fluxes for today's most demanding applications

Master Bond Inc. introduces new one part thermally conductive, electrically insulative silicone system

View articletitled, Master Bond Inc. introduces new one part thermally conductive, electrically insulative silicone system
Add to Citation Manager for Master Bond Inc. introduces new one part thermally conductive, electrically insulative silicone system

Thermo Electron's ARL QUANT'X EDXRF spectrometer complies with new RoHS and WEEE regulations

View articletitled, Thermo Electron's ARL QUANT'X EDXRF spectrometer complies with new RoHS and WEEE regulations
Add to Citation Manager for Thermo Electron's ARL QUANT'X EDXRF spectrometer complies with new RoHS and WEEE regulations