Issues

Special Issue: IMAPS 2015 Poland. Guest Editor: Agata Skwarek

Guest editorial

Agata Skwarek
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Method for validating CT length measurement of cracks inside solder joints

Tamás Garami; Oliver Krammer; Gábor Harsányi; Péter Martinek
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Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes

Balázs Illés; Olivér Krammer; Attila Géczy; Tamás Garami
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Comparative study on proper thermocouple attachment for vapour phase soldering profiling

Attila Géczy; Bíborka Kvanduk; Balazs Illes; Gábor Harsányi
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Mechanical reliability of solder joints in PCBs assembled in surface mount technology

Janusz Borecki; Tomasz Serzysko
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Influence of mechanical exposures on electrical properties of thin and thick-film flexible resistors and conductors

Paweł Osypiuk; Andrzej Dziedzic; Wojciech Stęplewski
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Mechanical properties of SMD interconnections on flexible and rigid substrates

Damian Nowak; Andrzej Dziedzic; Zbigniew Żaluk; Henryk Roguszczak; Mariusz Węglarski
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