Issues

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Yansong Tan; Xin Li; Xu Chen; Zhenwen Yang; Guo-Quan Lu
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Chromium effects on the microstructural, mechanical and thermal properties of a rapidly solidified eutectic Sn-Ag alloy

Sanaa Razzaq Abbas; Mohammed S. Gumaan; Rizk Mostafa Shalaby
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Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies

Muhammad Naqib Nashrudin; Zhong Li Gan; Aizat Abas; M.H.H. Ishak; M. Yusuf Tura Ali
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Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu

Norliza Ismail; Azman Jalar; Maria Abu Bakar; Roslina Ismail; Najib Saedi Ibrahim
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SMT assembly effects on organic substrate lifetime reduction

Seok-Hwan Huh
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Prediction of viscosity of ternary tin-based lead-free solder melt using BP neural network

Min Wu; Bailin Lv
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Experimental and numerical fatigue life assessment of SAC305 solders subjected to combined temperature and harmonic vibration loadings

Mohammad Gharaibeh
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