Issues

ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder

Hamed Al-sorory; Mohammed S. Gumaan; Rizk Mostafa Shalaby
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IC solder joint inspection via adaptive statistical modeling

Meng Xiao; Nian Cai; Zhuokun Mo; Shule Yan; Nili Tian; Jing Ma; Han Wang
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Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted

Guisheng Gan; Shiqi Chen; Liujie Jiang; Cong Liu; Tian Huang; Peng Ma; Dayong Cheng; Xin Liu
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Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature

Guisheng Gan; Shiqi Chen; Liujie Jiang; Qianzhu Xu; Tian Huang; Dayong Cheng; Xin Liu
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Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process

Fei Chong Ng; Aizat Abas; Mohamad Riduwan Ramli; Mohamad Fikri Mohd Sharif; Fakhrozi Che Ani
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A review: effect of copper percentage solder alloy after laser soldering

Asyraf Abdullah; Siti Rabiatull Aisha Idris
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