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Journal Articles

Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan

Soldering & Surface Mount Technology (2008) 20 (2): 11–20.

https://doi.org/10.1108/09540910810871520

Published: 11 April 2008

View article titled, Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

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Journal Articles

Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan

Soldering & Surface Mount Technology (2008) 20 (2): 21–29.

https://doi.org/10.1108/09540910810871539

Published: 11 April 2008

View article titled, Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

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Journal Articles

Design, materials and process for lead‐free assembly of high‐density packages

Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher, Bob Sullivan

Soldering & Surface Mount Technology (2004) 16 (1): 53–62.

https://doi.org/10.1108/09540910410517068

Published: 01 April 2004

View article titled, Design, materials and process for lead‐free assembly of high‐density packages

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