Skip to Main Content
Walter Dauksher
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

Available to Purchase
John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 21–29.
https://doi.org/10.1108/09540910810871539
Published: 11 April 2008
View article titled, Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)
Open the PDF for Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg) in another window
Add to Citation Manager for Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)
Journal Articles

Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

Available to Purchase
John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 11–20.
https://doi.org/10.1108/09540910810871520
Published: 11 April 2008
View article titled, Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)
Open the PDF for Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg) in another window
Add to Citation Manager for Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)
Journal Articles

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

Available to Purchase
John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 46–68.
https://doi.org/10.1108/09540910410537336
Published: 01 August 2004
View article titled, Reliability testing and data analysis of lead‐free solder joints for high‐density packages
Open the PDF for Reliability testing and data analysis of lead‐free solder joints for high‐density packages in another window
Add to Citation Manager for Reliability testing and data analysis of lead‐free solder joints for high‐density packages
Journal Articles

Failure analysis of lead‐free solder joints for high‐density packages

Available to Purchase
John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 69–76.
https://doi.org/10.1108/09540910410537345
Published: 01 August 2004
View article titled, Failure analysis of lead‐free solder joints for high‐density packages
Open the PDF for Failure analysis of lead‐free solder joints for high‐density packages in another window
Add to Citation Manager for Failure analysis of lead‐free solder joints for high‐density packages
Journal Articles

Design, materials and process for lead‐free assembly of high‐density packages

Available to Purchase
Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 53–62.
https://doi.org/10.1108/09540910410517068
Published: 01 April 2004
View article titled, Design, materials and process for lead‐free assembly of high‐density packages
Open the PDF for Design, materials and process for lead‐free assembly of high‐density packages in another window
Add to Citation Manager for Design, materials and process for lead‐free assembly of high‐density packages
Journal Articles

Design for lead‐free solder joint reliability of high‐density packages

Available to Purchase
John Lau, Walter Dauksher, Joe Smetana, Rob Horsley, Dongkai Shangguan, Todd Castello, Irv Menis, Dave Love, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 12–26.
https://doi.org/10.1108/09540910410517013
Published: 01 April 2004
View article titled, Design for lead‐free solder joint reliability of high‐density packages
Open the PDF for Design for lead‐free solder joint reliability of high‐density packages in another window
Add to Citation Manager for Design for lead‐free solder joint reliability of high‐density packages
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal