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Journal Articles

Failure analysis of lead‐free solder joints for high‐density packages

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John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 69–76.
https://doi.org/10.1108/09540910410537345
Published: 01 August 2004
View article titled, Failure analysis of lead‐free solder joints for high‐density packages
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Journal Articles

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

Available to Purchase
John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 46–68.
https://doi.org/10.1108/09540910410537336
Published: 01 August 2004
View article titled, Reliability testing and data analysis of lead‐free solder joints for high‐density packages
Open the PDF for Reliability testing and data analysis of lead‐free solder joints for high‐density packages in another window
Add to Citation Manager for Reliability testing and data analysis of lead‐free solder joints for high‐density packages
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