John Lau
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Journal Articles

Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 21–29.
https://doi.org/10.1108/09540910810871539
Published: 11 April 2008
View article titled, Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)
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Journal Articles

Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

John Lau, Jerry Gleason, Valeska Schroeder, Gregory Henshall, Walter Dauksher, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 11–20.
https://doi.org/10.1108/09540910810871520
Published: 11 April 2008
View article titled, Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)
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Journal Articles

Reliability testing and data analysis of lead‐free solder joints for high‐density packages

John Lau, Nick Hoo, Rob Horsley, Joe Smetana, Dongkai Shangguan, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 46–68.
https://doi.org/10.1108/09540910410537336
Published: 01 August 2004
View article titled, Reliability testing and data analysis of lead‐free solder joints for high‐density packages
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Journal Articles

Failure analysis of lead‐free solder joints for high‐density packages

John Lau, Dongkai Shangguan, Todd Castello, Rob Horsley, Joe Smetana, Nick Hoo, Walter Dauksher, Dave Love, Irv Menis, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (2): 69–76.
https://doi.org/10.1108/09540910410537345
Published: 01 August 2004
View article titled, Failure analysis of lead‐free solder joints for high‐density packages
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Journal Articles

Design, materials and process for lead‐free assembly of high‐density packages

Joe Smetana, Rob Horsley, John Lau, Ken Snowdon, Dongkai Shangguan, Jerry Gleason, Irv Memis, Dave Love, Walter Dauksher, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 53–62.
https://doi.org/10.1108/09540910410517068
Published: 01 April 2004
View article titled, Design, materials and process for lead‐free assembly of high‐density packages
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Journal Articles

Design for lead‐free solder joint reliability of high‐density packages

John Lau, Walter Dauksher, Joe Smetana, Rob Horsley, Dongkai Shangguan, Todd Castello, Irv Menis, Dave Love, Bob Sullivan
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2004) 16 (1): 12–26.
https://doi.org/10.1108/09540910410517013
Published: 01 April 2004
View article titled, Design for lead‐free solder joint reliability of high‐density packages
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