... et al., 2018). Finite element modelling (FEM) Stress analysis Finite element analysis Taguchi method Solder joint reliability 3D IC package Figure 5 Von Mises stress distribution of the 3-D package At present, the main problems that restrict the development of 3-D IC...

... structure, is developed to estimate the temperature of stacked chips. Two fundamental theories are used in this paper – Laplace’s equation and the thermal resistance network – to calculate 1D thermal resistance and thermal spreading resistance on the 3D IC package. Findings This paper provides...