... encapsulation process by mean of experimental and numerical method. Design/methodology/approach Lattice Boltzmann method (LBM) numerical was used for the three-dimensional simulation of underfill process. The effects of ball grid arrays (BGA) encapsulation process in terms of filling time of the fluid were...

... be contacted at: siva@iitm.ac.in © Emerald Group Publishing Limited 2012 Soldering Flow Deformation Stress (materials) Flip‐chip Reflow Ball grid array Residual stresses Residual warpage Zhang et al. (2004) used finite element method (FEM) to model temperature...

...Shi‐Wei Ricky Lee; Ben Hoi Wai Lui; Y.H. Kong; Bernard Baylon; Timothy Leung; Pompeo Umali; Hector Agtarap Evaluates the board level reliability of plastic ball grid array (PBGA) assemblies under thermal and mechanical loading, with the objective of characterizing the reliability of lead‐free...

..._‐p‐qAu_pNi_q)₆Sn₅ were present near the interface right after reflow, and there was a layer of solder between these two intermetallic compounds. Surface finishing Lead‐free soldering Intermetallics Ball grid array...

...C.H. Zhong; S. Yi; D.C. Whalley Plastic ball grid array packages were aged for up to 2000 hours. Various solder ball pad metallurgies were studied and solder ball shear tests were conducted at a range of ageing times. The solder ball shear strength was found to decrease after an initial hardening...

... – 8 . Lau , J.H. and Pao , Y. (1997), Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies , McGraw‐Hill , New York . Levis , K. and Mawer , A. (2000), Assembly and Solder Joint Reliability of Plastic Ball Grid Array with Lead‐Free versus...

... for ball grid arrays. It is part of a Web site of a German company manufacturing equipment for this. It is a mournful-looking site with sales arguments that sometimes border on the limit of the ethical. For example, it claims that the technique is friendly to the environment, without mentioning...

... © MCB UP Limited 2001 --> Metcal Ball grid array Metcal delivers enhanced version of BGA array package rework system Keywords: Metcal, Ball grid array Metcal have launched an enhanced version of their BGA rework system. This system is available in two models...

... © MCB UP Limited 2000 --> Metcal Heaters Rework Ball grid array Keywords Metcal, Heaters, Rework, Ball grid array The complexity and reduced size of array packages, such as BGAs and certain types of CSPs, has made the successful rework of such devices, particularly...

... Keywords Intertronics, Lead-free soldering, Ball grid array Intertronics has announced the introduction of lead-free solder spheres on SolderQuik BGA preforms in response to approaching regulations which ban the use of lead in the electronics manufacturing process. The new variant...

... © MCB UP Limited 2000 --> Speedline ACCEL Reflow Cleaning Ball grid array Speedline ACCEL's new MicroPro™ integrates the reflow and cleaning process Keywords: Speedline ACCEL, Reflow, Cleaning, Ball grid array Speedline ACCEL's new MicroPro™...

... © MCB UP Limited 2000 --> Speedline CAMALOT Ball grid array Placement The Matrixx system works by moving the BGA package to a fluxing gantry on a BGA strip, Auer®3">1 Boat, or JEDEC tray, where transfer pins apply the flux. Trays then move to a second gantry where solder...

... © MCB UP Limited 1999 --> X-TEK Inspection Ball grid array X-ray Launch of affordable system for BGA inspection Keywords X-TEK, Inspection, Ball grid array,X-ray The Model CPX x-ray inspection system launched by X-TEK at Nepcon UK represents a new direction...

...William Casey The rapid progress of ball grid array (BGA) component technology has served to alleviate many problems associated with the placement and soldering of high lead count, fine pitch surface mount technology (SMT) packages. An unfortunate result of this process, however, is the occurrence...

... (OSP), a hot air solder leveling (HASL), a silver plated (Ag) and an electroless flash gold over nickel (Au/Ni) surface finish. All of the PWBs were inspected for: © MCB UP Limited 1999 Assembly Ball grid array Chipscale packaging Microvias Surface mount technology Before...

... IPC ITRI releases BGA guidelines report Keywords ITRI, Ball grid array, Aerospace The Interconnection Technology Research Institute (ITRI) has released the findings of a three-year investigation into the use of ball grid array (BGA) packaging for space flight applications...

...Volker‐Ekkehart Koch A ball grid array (BGA) is a surface‐mount device and is processed in a standard surface‐mount (SM) assembly line. However, there are some special features which make it different from other assemblies. The peculiarities of PCB layout, screen printing, placement, soldering...

...J.H. Lau The objective of this paper is to point out the limitations and ròles of DNP (distance to neutral point) on predicting the solder‐joint thermal‐fatigue life of area‐array assemblies. © MCB UP Limited 1997 Solder joint Reliability Ball grid array DNP DNP is defined...

... solder attachments. The results of low‐acceleration reliability tests for the solder attachments of ball grid arrays (BGAs) and column grid arrays (CGAs) are reported in this paper. The tests were designed to mimic the thermal conditions of the use environment of the product, including internal power...