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Keywords: CNT
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (3): 157–164.
Published: 11 February 2020
...Norliza Ismail; Azman Jalar; Maria Abu Bakar; Roslina Ismail; Najib Saedi Ibrahim Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (1): 12–17.
Published: 28 January 2014
... interconnect materials in printing process are also evaluated. The paper aims to discuss these issues. Design/methodology/approach – Micron-sized silver flakes are used as the basic fillers, and submicro- and nano-sized silver spheres and carbon nanotubes (CNTs) are adopted to obtain conductive adhesives...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (3): 206–215.
Published: 22 June 2012
... approximately 80 wt% of silver particles. Its flexibility allows for it to be used in applications that are subject to bending or vibration. This adhesive was used as the carrier for the preparation of CA/CNT. 0.5 wt% of multi‐wall CNTs, produced by combustion chemical vapor deposition with no further...
