Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-3 of 3
Keywords: CNT
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Effect of flux functional group for solder paste formulation towards soldering quality of SAC305/CNT/Cu
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (3): 157–164.
Published: 11 February 2020
...Norliza Ismail; Azman Jalar; Maria Abu Bakar; Roslina Ismail; Najib Saedi Ibrahim Purpose The purpose of this paper is to investigate the wettability and intermetallic (IMC) layer formation of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint according to the formulation of solder paste because...
Journal Articles
Characterization of nano-enhanced interconnect materials for fine pitch assembly
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (1): 12–17.
Published: 28 January 2014
... interconnect materials in printing process are also evaluated. The paper aims to discuss these issues. Design/methodology/approach – Micron-sized silver flakes are used as the basic fillers, and submicro- and nano-sized silver spheres and carbon nanotubes (CNTs) are adopted to obtain conductive adhesives...
Journal Articles
Mechanical durability of RFID chip joints assembled on flexible substrates
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (3): 206–215.
Published: 22 June 2012
.... The microstructures of the applied materials were observed with the use of a scanning electron microscope (SEM). Failures in RFID chip joints after the shear and bending tests were studied using an optical microscope. In the following investigations, a CA with an additional amount and type of carbon nanotubes (CNTs...
