Update search
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
Filter
- All
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- EISBN
- ISSN
- EISSN
- Issue
- Volume
- References
NARROW
Format
Journal
Type
Date
Availability
1-5 of 5
Keywords: Composite materials
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (2): 92–98.
Published: 03 April 2017
... 08 2016 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Intermetallic compounds Microstructure Copper Solder paste Composite materials Up to now, several types of binary and ternary Sn-based lead-free solders such as Sn–Ag, Sn–Cu...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2016) 28 (3): 159–166.
Published: 06 June 2016
...@hust.edu.cn 23 02 2016 26 04 2016 10 05 2016 © Emerald Group Publishing Limited 2016 Emerald Group Publishing Limited Licensed re-use rights only Solder Composite materials Retained ratio SAC Electronic materials Reflow cycles Lead-free solder Lead-containing...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (2): 68–74.
Published: 12 April 2011
... nanocomposite solders in a planetary ball mill process, and the data are compared with related researches done. A.S.M.A. Haseeb can be contacted at: haseeb@um.edu.my © Emerald Group Publishing Limited 2011 Mechanical properties of materials Solder Composite materials Copper Nanotechnology...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (4): 50–56.
Published: 21 September 2010
... in the temperature range 283‐398 K and at applied stresses ranging from 4 to 20 MPa. These temperatures and applied stresses ranges were designed in order to meet actual application conditions. Solder Creep Composite materials Owing to the inherent toxicity of lead (Pb), the prohibition of Pb‐bearing...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 14–18.
Published: 10 April 2009
... at: jiezhao@dlut.edu.cn © Emerald Group Publishing Limited 2009 Solders Composite materials Magnetic fields Physical properties of materials Since high‐magnetic fields can change mass transitions on the atomic scale, many recent studies have focused on the application of high‐magnetic...
