...Guang Ren; Maurice Collins Purpose This paper aims to investigate the creep behaviour of the recently developed Sn–8Zn–3Bi–xSb (x = 0, 0.5, 1.0 and 1.5) low temperature lead-free solder alloys. Design/methodology/approach An in-house compressive test rig was developed to perform creep...

... combined loading approach a promising and affective method for accelerated reliability tests. Both indentation and FRIS techniques by numerous possibilities of loading conditions seem to be appropriate in order to study the creep and fatigue behaviour. That kind of behaviours can be used by different...

... which may have important implications for packaging reliability (Lu et al., 1992). Assembly Stress (materials) Sintering Nanosilver Stress relaxation Temperature cycling Creep Die‐attach Residual curvature A typical temperature cycling profile from −40°C to 125°C...

...A.E. Marks; N.N. Ekere; S. Mallik; R. Bhatti Purpose The purpose of this paper is to investigate how the formulation of a solder paste (with regards to the flux and particle size distribution (PSD)), can influence its creep and recovery performance. Design/methodology/approach New lead‐free...

... under thermal cycling. The mechanical properties and reliability of solder joints were characterized by using thermal fatigue and creep tests, while the microstructure of the solder alloy and SnAgCu/SnAgCuCe solder joints were also investigated in the experimental procedure. Findings The simulation...

...Feng Tai; Fu Guo; Jianping Liu; Zhidong Xia; Yaowu Shi; Yongping Lei; Xiaoyan Li Purpose The purpose of this paper is to investigate the creep properties of Sn‐0.7Cu composite solder joints reinforced with optimal nano‐sized Ag particles in order to improve the creep performance of lead‐free...

...Liang Zhang; Song-bai Xue; Li-li Gao; Yan Chen; Sheng-lin Yu; Zhong Sheng; Guang Zeng Purpose The purpose of this paper is to investigate the effects of minor addition of the rare earth (RE) element cerium, Ce, on the microstructures and creep properties of Sn-Ag-Cu solder alloys. Design...

... the creep‐recovery, thixotropy and viscosity test methods. A rheometer with a parallel plate measuring geometry of 40 mm diameter and a gap height of 1 mm was used to characterise the paste and associated flux media. Findings The results from the study showed that the creep‐recovery test can be used...

...‐elastic region is independent of frequency for all the solder paste samples. To understand the shear thinning behaviour of solder paste, the well known Cross and Carreau models were fitted to the viscosity data. Moreover, creep‐recovery and dynamic frequency‐sweep tests were also carried out without...

...Janne J. Sundelin; Sami T. Nurmi; Toivo K. Lepistö; Eero O. Ristolainen Purpose To provide further knowledge of the effect of solder composition and PCB surface finish on the creep properties of lead‐free SnAgCu solder joints. Design/methodology/approach Single‐overlap shear specimens were...

...John H. Lau An exact analysis is presented of the creep deformation of cylindrical solder interconnects subjected to the actions of bending moments, twisting moments, and axial forces. Dimensionless interaction curves and charts are also provided for engineering practice convenience. These charts...