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1-3 of 3
Keywords: Density
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Journal Articles
Thermophysical properties and wetting behavior on Cu of selected SAC alloys
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (2): 71–76.
Published: 06 April 2012
...Przemyslaw Fima; Tomasz Gancarz; Janusz Pstrus; Krystyna Bukat; Janusz Sitek Purpose The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior...
Journal Articles
Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 11–20.
Published: 11 April 2008
...John Lau; Jerry Gleason; Valeska Schroeder; Gregory Henshall; Walter Dauksher; Bob Sullivan Purpose The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development...
Journal Articles
Reliability test and failure analysis of high‐density packages assembled with a low‐temperature lead‐free solder (SnBiAg)
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 21–29.
Published: 11 April 2008
...John Lau; Jerry Gleason; Valeska Schroeder; Gregory Henshall; Walter Dauksher; Bob Sullivan Purpose The High Density Packaging Users Group Consortium has conducted a study of process development and solder‐joint reliability of high‐density packages on printed circuit boards (PCB) using a low...
