... important support for optimizing the curing process for various ACF‐based packaging applications, such as chip‐on‐glass packaging of liquid crystal displays and flip‐chip bonding of radio frequency identification, etc. Flipchips Packaging Films (states of matter) Joining processes Bo Tao...

.... S. Mallik can be contacted at: s.mallik@gre.ac.uk © Emerald Group Publishing Limited 2010 Solder paste Viscosity Flipchips Rheology Solder paste is the primary bonding medium used in the surface mount assembly process and plays a crucial role by providing electrical...

... the influence of thermal cycling. Kati Kokko can be contacted at: kati.kokko@tut.fi © Emerald Group Publishing Limited 2010 Coatings Flipchips Substrates Adhesives Polymers Printed circuits Conformal coating may affect the reliability of the electronic device when thermal cycling...

... bond thickness variation in ACA assemblies. Guangbin Dou can be contacted at: g.dou@imperial.ac.uk © Emerald Group Publishing Limited 2010 Adhesives Assembly Bonding Joining processes Flipchips Anisotropic conductive adhesives (ACAs) are conceptually a simple method...

... be contacted at: kati.kokko@tut.fi © Emerald Group Publishing Limited 2009 Coatings technology Adhesives Joining materials Flipchips The shielding of electronic devices from ambient conditions is important in many applications, including implantable medical devices. Moreover...

..., soldering to OSP coated copper would be even worse. Depending on the application, the imperfect collapse observed below may thus have serious consequences. Soldering Assembly Flipchips Yield Most lead‐free solder alloys considered for microelectronic assembly do not reflow and wet...