...Ye Tian; Haojie Chen; Lushan Ma; Chao Wang; Ziqiang Li; Lei Ma; Yongfeng Dong; Xing Chen Purpose This paper aims to systematically summarize recent advances in low-temperature interconnection using Cu nanoparticles, nanoporous Cu and one-dimensional (1D) nanocopper arrays, clarify their advantages...

...Maria Lykova; Iuliana Panchenko; Ulrich Künzelmann; Johanna Reif; Marion Geidel; M. Jürgen Wolf; Klaus-Dieter Lang Purpose Cu/Cu diffusion bonding is characterised by high electrical and thermal conductivity, as well as the mechanical strength of the interconnects. But despite a number...

... structures in which the interconnection layer is discrete, mechanical bending has been modeled with respect to varying silicon chip length. The analytical model that describes the stress of the outermost solder joint experiences is chosen, as this is the typical solder joint failure. The analytical model can...

...) module symmetrically (solder bump interconnection with Cu-Pillar). Note that Cu-Pillar bumping is known to possess good electrical properties and better electromigration performance. The drawback is that the Cu-Pillar bump can introduce high stress due to the higher stiffness of Cu compared to the solder...

... Interconnects Pb-free Solder joints Stencil printing Wafer-level package Numerous factors determine the quality of the printed deposits such as the stencil, solder paste, printing parameters, printer, squeegee and environmental conditions (Haslehurst and Ekere, 1996 ; Nguty et al., 1999...

...Si Chen Purpose The transferred carbon nanofibers (CNFs) can be applied in flip chip package as interconnect material, as an alternative to the conventional solder and conductive adhesive (CA) materials. Design/methodology/approach The structure of CNFs was confirmed by transmission electron...