...De‐Shin Liu; Chang‐Lin Hsu; Chia‐Yuan Kuo; Ya‐Ling Huang; Kwang‐Lung Lin; Geng‐Shin Shen Purpose The purpose of this paper is to present a novel high speed impact testing method for evaluating the effects of low temperatures on eutectic and lead‐free solder joints. Interfacial cracking failure...

...Olli Nousiainen; Timo Urhonen; Tero Kangasvieri; Risto Rautioaho; Jouko Vähäkangas Purpose The purpose of this paper is to investigate the feasibility of using land grid array (LGA) solder joints as a second-level interconnection option in low-temperature co-fired ceramic (LTCC)/printed wiring...

.... Y.C. Liu can be contacted at: licmtju@vip.163.com 12 02 2009 08 10 2009 08 10 2009 © Emerald Publishing Limited 2010 Emerald Publishing Limited Licensed re-use rights only Solder Zinc Physical properties of materials Low temperatures Natural Science...

... the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages. Findings It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent. Originality/value The paper is of value...

.../methodology/approach The design for reliability, materials, and assembly process aspects of the project have been discussed in “Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)” also published in this journal issue. In this study, reliability...