.... The cost of the solder with added Pr is limited to RMB 2 yuan/kg so it can be widely used in industry. Songbai Xue can be contacted at: xuesb@nuaa.edu.cn © Emerald Group Publishing Limited 2012 Mechanical properties of materials Metals Solders Alloys Tin‐Zinc Praseodymium...

... flux of Cu reaching at the ϵ/η interface becomes less, and the Cu₃Sn layer grows slower with increasing aging time, as indicated by the parabolic growth curves in Figure 3(a) . © Emerald Group Publishing Limited 2011 Soldering Joining processes Metals A growth...

... on the substrate dissolution rate and the interfacial IMC between the SAC solder and copper substrate. Commercial molybdenum nanopowder (99.8 per cent trace metal basis) was manually mixed with SAC solder paste (Indium Corporation of America) for a nominal composition of up to 5 wt%. The molybdenum nanopowder...

... Metals The reliability of components is normally determined by standardized methods (Berek et al., 1998). Because different stress tests accelerate different failure mechanisms, a reliability test is usually chosen based on the failure mechanism and failure mode of interest. In this paper...

... in Figure 2 . It reveals that the reason for this crack was a broken and missing piece of the glass solder mask on the Ag base metallization. In this area, solder was spread over the base metallization, resulting in ceramic cracking similar to primary ceramic cracking in non‐solder‐mask LTCC modules...

... and mechanical properties of solder joints. © Emerald Group Publishing Limited 2011 Soldering Metals Mechanical properties of materials Joining processes In electronic assembly and electronic packaging, solder joints are commonly used to connect the electronic components with the substrate...

... Limited 2011 Solder Mechanical properties of materials Metals Tensile strength Extensive investigations into the microstructural formation of Sn‐3.7Ag‐0.9Zn eutectic alloy were performed recently (Wei et al., 2008, 2009 ; Wan et al., 2008a, b), and the fourth...

... in practical electronics industry applications. In the meantime, the reason for the superior reliability of SnAgCuCe solder joints can be explained from the property and microstructural point‐of‐view. Solder Alloys Finite element analysis Creep Metals Mechanical behaviour of materials Many...

... (BGA) solder joint configuration. In most cases, co‐fired Ag‐based thick films are used as the solder lands on LTCC. Although it has been suggested recently that AgPd metallization may be used in lead‐free 1st level interconnections between silicon chips and the LTCC substrate (Zhong et al...

... 2010 Solders Lead Mechanical properties of materials Metals Tensile strength Because of the environmental issues of lead, lead‐free solders are taking the place of Sn−Pb solders (Zeng and Tu, 2002 ; Deng et al., 2005, 2003 ; He et al., 2005). However...

... at the metal/substrate interface during solidification of Pb‐Sn solder alloys ”, J. Mater. Eng. Perform. , Vol. 11 No. 3 , pp. 265 ‐ 73 . Puttlitz , K.J. and Stalter , K. (2004), Handbook of Lead‐Free Solder Technology for Microelectronic Assemblies , CRC Press , New York, NY...

...Patrick Zerrer; Andreas Fix; Matthias Hutter; Herbert Reichl Purpose The purpose of this paper is to develop a new alloying method for solders by using a metal organic modified flux in solder pastes. Design/methodology/approach This paper presents the impact of six metal organic compounds (Co...

... soldered with tin‐silver‐copper solder (Nurmi et al., 2003). However, the effects of soldering components with tin‐silver‐copper surface finishes using tin‐lead‐based solder have not yet been studied in detail. Soldering Solder Lead Metals With the front runner SnAgCu (SAC) solder...