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Keywords: Packaging processes
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (1): 38–50.
Published: 03 February 2012
... widespread use. © Emerald Group Publishing Limited 2012 Stencil printing Microelectronics packaging Innovation Packaging processes Stencil printing is used in the electronic packaging industry primarily to generate the mechanical and electrically conductive interconnects between...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 11–20.
Published: 11 April 2008
...., 1997). John Lau can be contacted at: lauhs@ime.a‐star.edu.sg © Emerald Group Publishing Limited 2008 Solder Lead Low temperatures Density Packaging processes One of the major implications of the RoHS directive has been to proscribe the use of lead in many electronics...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2008) 20 (2): 21–29.
Published: 11 April 2008
... temperatures Packaging processes Density Owing to the current lack of experimental and simulation data and field experience, one of the critical issues for industry of lead‐free soldering is the solder joint reliability. Reliability can be defined (Lau, 1992) as the probability that a component...
