Keywords: Placement
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Journal Articles
Soldering & Surface Mount Technology (2001) 13 (2)
Published: 01 August 2001
..., and the open architecture feeding system accommodates all types of component, packaging and feeding, such as tape and reel, single or multi-stick, radial and axial, bulk and single or multi-tray unit.   Plate 4 OSP odd-form placement - Contax The Celtronix OSP-1 odd-form placement system...
Journal Articles
Soldering & Surface Mount Technology (2001) 13 (2)
Published: 01 August 2001
... Contax Placement Contax Component Placement with the Contact 3Z Keywords: Contax, Placement The 3Z Component Placement solution has claimed the highest placement rate(13,000cph) of any machine in its class thanks to the two independently positioned heads with two spindles...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (3)
Published: 01 December 2000
... © MCB UP Limited 2000 --> Juki Automation Systems Placement Juki takes component placement into the 21st century Keywords Juki Automation Systems, Placement Juki Automation Systems has introduced a new series of placement machines that are set to push back...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (3)
Published: 01 December 2000
... © MCB UP Limited 2000 --> Siplace Placement Siplace S and Siplace F introduce placement head modularity Keywords Siplace, Placement The Production and Logistics Systems Group (PL) has added another feature to the flexibility of the S and F Siplace placement...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Juki Automation Systems Placement Keywords Juki Automation Systems, Placement Juki Automation Systems, Inc. has introduced the 2000 Series placement machines (Plate 3), combining high flexibility and accuracy with, it is claimed,the fastest...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (2)
Published: 01 August 2000
... © MCB UP Limited 2000 --> Quad Systems Placement Integrated circuits Keywords Quad Systems, Placement, Integrated circuits Quad Systems Corporation introduced the Quad MeridianTM 1050 Series to the North American market at APEX 2000. The Quad Meridian 1050...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> Speedline CAMALOT Ball grid array Placement Speedline CAMALOT enters sphere placement market with new Matrixx™ system Keywords: Speedline CAMALOT, Ball grid array, Placement The speed and quality of BGA sphere placement...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> Intertronics Siemens Placement Siemens replacement pick and place vacuum nozzles introduced Keywords: Intertronics, Siemens, Placement Intertronics has announced a new replacement pick and place vacuum nozzle(Plate 2) for Siemens S-20...
Journal Articles
Soldering & Surface Mount Technology (2000) 12 (1)
Published: 01 April 2000
... © MCB UP Limited 2000 --> Quad Systems Placement Software New, easy-to-use Quad operating software Keywords: Quad Systems, Placement, Software Quad Systems Corporation recently began field tests of the new version of its proprietary placement system operating...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> MYDATA Placement MYDATA releases two new placement machines ­ MY9 and MY12 Keywords MYDATA, Placement This new family of machines was built with future technologies in mind by supplying a solid stable platform for accuracy. Both...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (3)
Published: 01 December 1999
... © MCB UP Limited 1999 --> Siemens Placement Printed circuit boards Throughput The SIPLACE Productivity Lift can be integrated with all SIPLACE equipment; the SIPLACE HS 50, 80 S 20 and the new 80 S 23 (HM) high-speed machines; the 80 F4 and 80 F5 high-flexibility machines...
Journal Articles
Soldering & Surface Mount Technology (1999) 11 (2)
Published: 01 August 1999
... Quad Systems Corporation has improved the placement process capability of its APS-1 Advanced Packaging System assembler. The new specification is ± 19 microns (±0.00075 inches) @ 3 sigma. This represents a substantial improvement in the ability of the APS-1 to place today's finest pitch flip...

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