... transfer mechanisms of the reflow soldering process. Given the current high computing power available, ML models can reduce the time required for profiling from at least half a day of trial and error to just one hour. Table 1 Zone temperatures and conveyor speeds Zone...

.../methodology/approach In this study, computational fluid dynamics modeling is used to simulate the reflow soldering process. The training data provided to the machine learning (ML) model is generated from a programmed system based on the physics model. Support vector regression and an artificial neural...

... by violating the minimal electrical clearance on the printed circuit board (PCB). In modern lead-free reflow soldering, especially in high-reliability industries, such as automotive, aeroplane and aerospace, detecting and preventing such defects is essential in reliable and cost-effective manufacturing...

...Yutian Yin; Hongda Zhou; Cai Chen; Yi Zheng; Hongqiao Shen; Yubing Gong Purpose The simulated temperature profile of the printed circuit board assembly (PCBA) during reflow soldering process deviates from the actual profile. To reduce this relative deviation, a new strategy based on the Kriging...

... at 230°C for 20 min and then samples were cooled at room temperature. After reflow soldering, the samples are aged at 150°C with different duration time (250 h, 500 h, 1,000 h and 2,000 h) by following the JEDEC standard (JESD22-A103C). In order to conduct the shear strength evaluation, single-lap joint...

...Barbara Dziurdzia; Maciej Sobolewski; Janusz Mikołajek; Sebastian Wroński Purpose This paper aims to investigate voiding phenomena in solder joints under thermal pads of light-emitting diodes (LEDs) assembled in mass production environment by reflow soldering by using seven low-voiding lead-free...

... soldering Heat transfer Vapour phase soldering Heat transfer coefficient Condensation soldering Reflow soldering where c (J/kg °C) is the specific heat capacity, m (kg) is the mass, t (s) is the time, h (W/[m²°C]) is the heat transfer coefficient, A (m^{2) is the heated}...

... the component’s self-alignment point of view. Furthermore, machine learning-based predictors can be applied in the field of reflow soldering technology, and artificial neural networks can predict the component self-alignment with an appropriately low error. (2) N = S α ⋅ [ dim ⁡ ( I ) + dim...

.... Design/methodology/approach This study was written according to the results of a wide literature review about the substantial previous works in the past decade and according to the authors’ own results. Findings Up to now, a part of the electronics industry believes that the reflow soldering...

... printing to control a thickness of SP and reflow soldering oven to minimize the number of voids. The LED with SP1, SP2 and SP3 is tested at various input currents and ambient temperatures. Findings The results indicate that at high input current, which equals to 1,200 mA, R_th–JA...

... be contacted at: jagjiwanmittal@gmail.com 10 10 2017 16 01 2018 04 02 2018 08 02 2018 © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use rights only Intermetallic compounds IMC Solder alloys Diffusion Reflow soldering Sn-Zn Tin has...

... + ∂ U j ∂ x i ) The flow is considered as compressible Newtonian fluid, because the spatial pressure change has effect on the density of the vapour: (2) ∂ ρ ∂ t + ∇ ( ρ U ) = 0 Reflow soldering Numerical simulation Gas void Vacuum VPS...

...@we.am.gdynia.pl 03 10 2017 03 01 2018 12 01 2018 © Emerald Publishing Limited 2018 Emerald Publishing Limited Licensed re-use rights only Solder SMD Reflow soldering X-ray imaging Thermal profiling Light emitting diodes (LEDs) modules are basic components of solid...

... the LED and the PCB. For the LED applications in this paper, the solder interconnection needs to have low void percentage and high mechanical reliability. Both the choice of paste and the soldering process are crucial to reach the demanding requirements. Reflow soldering LED Fluxless Solder...

... of inclination at a selected time step Reflow soldering Thermal profiling Filmwise condensation Inclination Vapour phase soldering Vapour phase soldering (VPS) is a reflow soldering method (Leicht and Thumm, 2014) used in electronics manufacturing and which is considered as an alternative...

... On the basis of cause and effect diagram for solder voiding, the potential causes of voids and influence of process variables on void formation were found. Three process variables were chosen: the type of reflow soldering, vacuum incorporation and the type of solder paste. Samples of LEDs were mounted...

...Liming Chen; Enying Li; Hu Wang Purpose Reflow soldering process is an important step of the surface mount technology. The purpose of this paper is to minimize the maximum warpage of shielding frame by controlling reflow soldering control parameters. Design/methodology/approach Compared...

... soldering process, optimization and the future challenges in the reflow soldering process. Besides, the numerical approach of lead-free solder reliability is also discussed. Design/methodology/approach Lead-free reflow soldering is one of the most significant processes in the development of surface...

... evaluation based on the heating factor is presented and suggested for wider use. Vapour Phase Soldering (VPS) is an emerging reflow soldering method (Leicht and Thumm, 2008) in Surface Mount Technology. It has gained more attention from the electronics industry (Plotog et al., 2008) since...

... strength Solder joints Reflow soldering Reliability X-ray imaging The highly advanced development of the electronics industry means that almost every technical device (e.g. household appliances, power tools, devices for measuring, supervisory and control) contains at least one printed circuit...