...Uzair Naeem; Ow Guan Yi; Enis Nadia Md Yusof; Mohd Azli Salim; Anvar Makhkamov; Adil Alshoaibi; Dawei Wang; Ahmad Azmin Mohamad Purpose This study aims to investigate the effect of microwave hybrid heating ( MHH ) reflow on the corrosion immersion and mechanical reliability of SAC305/Cu solder...

...Aizat Abas; Muhamed Abdul Fatah Muhamed Mukhtar; Rilwan Kayode Apalowo; Fakhrozi Che Ani Purpose This study aims to investigate the design configuration for a multi-objective optimum solder height of reinforced SAC305 solder joints in an ultrafine capacitor assembly. Design/methodology/approach...

...) and deposition time (EP) significantly affected surface roughness. Additionally, the intermetallic compound (IMC) thickness for NAC305/ENEPImAg was found to be thinner (0.6 µm) than that of SAC305/ENImAg (1.6 µm), which correlates with improved solder joint quality. Originality/value This research presents...

...Rilwan Kayode Apalowo; Muhamed Abdul Fatah Muhamed Mukhtar; Mohamad Aizat Abas; Fakhrozi Che Ani Purpose This study aims to investigate the design configuration for an optimum solder height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Design/methodology/approach...

... 11 2023 30 04 2024 11 06 2024 27 06 2024 © Emerald Publishing Limited 2024 Emerald Publishing Limited Licensed re-use rights only SAC305 Laser soldering Micro void Finite volume method (FVM) Pin through-hole (PTH) Through-hole technology is a process...

... laser soldering experiment is used to evaluate the effect of various solder alloy materials, including SAC305, SAC387, SAC396 and SAC405 in laser soldering. These solders are commonly used to assemble the pin-through hole (PTH) capacitor onto the printed circuit board. Findings The simulation...

...Yanruoyue Li; Guicui Fu; Bo Wan; Zhaoxi Wu; Xiaojun Yan; Weifang Zhang Purpose The purpose of this study is to investigate the effect of electrical and thermal stresses on the void formation of the Sn3.0Ag0.5Cu (SAC305) lead-free ball grid array (BGA) solder joints and to propose a modified mean...

...Muhamad Zamri Yahaya; Nor Azmira Salleh; Soorathep Kheawhom; Balazs Illes; Muhammad Firdaus Mohd Nazeri; Ahmad Azmin Mohamad Purpose The purpose of this paper is to investigate the morphology of intermetallic (IMC) compounds and the mechanical properties of SAC305 solder alloy under different...

... using reflow soldering and a lead-free solder paste SAC305. The solder paste was printed on a plate through stencils of various apertures. It was expected that various apertures of stencils will moderate the various void contents in solder joints. K-type thermocouples mounted inside cylinders...

.... Various types of nanoparticles featuring distinctive properties and increased reliability have been used to reinforce the SAC solder alloys. The effects of TiO2 nanodopant on SAC305 solder paste were examined by Tang et al. (2014) . The average grain size and spacing between Ag3Sn grains...

... of TiO₂ on the microstructure and the fillet height of ultra-fine capacitors. SAC305 Nano-reinforced lead free solder Titanium dioxide nanoparticle Ultra-fine package Miniaturization and diversification are current trends in integrated circuit (IC) packaging. Miniature IC packages...

... of this paper is to investigate the relationship between tensile and nanoindentation tests toward the mechanical properties and deformation behavior of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire at room temperature. Design/methodology/approach Tensile test with different strain rates of 1.5 × 10-4 s-1...

...Izhan Abdullah; Muhammad Nubli Zulkifli; Azman Jalar; Roslina Ismail Purpose The purpose of this paper is to investigate the relationship between microstructure and varied strain rates towards the mechanical properties and deformation behaviour of Sn-3.0Ag-0.5Cu (SAC305) lead-free solder wire...

...Liu Mei Lee; Habsah Haliman; Ahmad Azmin Mohamad Purpose The purpose of this paper is to produce and investigate the interfacial reaction between Sn‐3.0Ag‐0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various temperatures and times. Design/methodology/approach SAC305 thin...