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Keywords: Sn-37Pb solder bumps
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Journal Articles
Guisheng Gan, Da-quan Xia, Xin Liu, Cong Liu, Hanlin Cheng, Zhongzhen Ming, Haoyang Gao, Dong-hua Yang, Yi-ping Wu
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2019) 31 (2): 85–92.
Published: 20 February 2019
.... Design/methodology/approach Thermal shock test between −55°C and 125 °C was conducted on Sn-37Pb solder bumps in the BGA package to investigate the microstructure evolution and the growth mechanism of interfacial intermetallic compound (IMC) layer. The effects of thermal shock on the mechanical property...
